| Presentation | 2010-02-19 A Study on Improvement for Seal property of Electromechanical Devices : The behavior of One-Part Epoxy Resin in a narrow gap Osamu Ohtani, Seiji Nakajima, Tomohiro Fukuhara, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Generally, one-part epoxy resin consists of liquid epoxy monomer, solid curing agent, and filler as a packing agent and so on. One-part epoxy resin is handled easy because the state of one-part epoxy resin is transformed from liquid to solid by the chemical reaction between liquid epoxy monomer and solid curing agent induced by just heating. One-part epoxy resin is widely used as a sealant of electro devices due to the above mentioned property and toughness and so on. With smaller size, higher density, and slimmer down of electro devices recently, the thickness and width of adhesion moieties in various parts come to be much smaller. In case of that the thickness of adhesion moieties is less than 100μm, solid epoxy resin and liquid epoxy monomer domains, which separated from the solid moieties, were observed even after heating. The liquid epoxy monomer domains were thought to be resulted in lowering of sealing property, but the separation mechanism has not been clarified. We report the separation mechanism and depression method of liquid epoxy monomer domains in narrow gap after heating. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Electromechanical device / Adhesion reliability / One-part epoxy resin |
| Paper # | R2009-51,EMD2009-118 |
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| Conference Information | |
| Committee | EMD |
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| Conference Date | 2010/2/12(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
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| Paper Information | |
| Registration To | Electromechanical Devices (EMD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | A Study on Improvement for Seal property of Electromechanical Devices : The behavior of One-Part Epoxy Resin in a narrow gap |
| Sub Title (in English) | |
| Keyword(1) | Electromechanical device |
| Keyword(2) | Adhesion reliability |
| Keyword(3) | One-part epoxy resin |
| 1st Author's Name | Osamu Ohtani |
| 1st Author's Affiliation | Material Center, Engineering Center, Electronic & Mechanical Components Business Company, Omron Corporation() |
| 2nd Author's Name | Seiji Nakajima |
| 2nd Author's Affiliation | Material Center, Engineering Center, Electronic & Mechanical Components Business Company, Omron Corporation |
| 3rd Author's Name | Tomohiro Fukuhara |
| 3rd Author's Affiliation | Material Center, Engineering Center, Electronic & Mechanical Components Business Company, Omron Corporation |
| Date | 2010-02-19 |
| Paper # | R2009-51,EMD2009-118 |
| Volume (vol) | vol.109 |
| Number (no) | 420 |
| Page | pp.pp.- |
| #Pages | 5 |
| Date of Issue | |