| Presentation | 2009-12-18 Magnetic Pulse Welding of a Copper Sheet to Metal Pillars (Copper Bumps) Tomokatsu AIZAWA, Keigo OKAGAWA, Tetsuo MACHIDA, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | This paper describes a new joining method of a copper sheet to metal pillars (copper bumps) and its experimental results. The pillars are put in holes of a thin insulator and near the sheet. When an impulse current from a capacitor bank passes through a flat one-turn coil, a magnetic flux is suddenly generated around the coil. Eddy currents are induced in the sheet placed between the coil and the insulator. Electromagnetic force acts on the sheet. The sheet can be welded to the pillers both by the Joule heat and by the high-speed collision to the pillers. The bank energy required for this welding is less than 2 kJ. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Magnetic pulse welding / Electromagnetic force / Joining / Copper bump / Large-current circuit board |
| Paper # | EMD2009-107 |
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| Conference Information | |
| Committee | EMD |
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| Conference Date | 2009/12/11(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
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| Paper Information | |
| Registration To | Electromechanical Devices (EMD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Magnetic Pulse Welding of a Copper Sheet to Metal Pillars (Copper Bumps) |
| Sub Title (in English) | |
| Keyword(1) | Magnetic pulse welding |
| Keyword(2) | Electromagnetic force |
| Keyword(3) | Joining |
| Keyword(4) | Copper bump |
| Keyword(5) | Large-current circuit board |
| 1st Author's Name | Tomokatsu AIZAWA |
| 1st Author's Affiliation | Tokyo Metropolitan College of Industrial Technology() |
| 2nd Author's Name | Keigo OKAGAWA |
| 2nd Author's Affiliation | Tokyo Metropolitan College of Industrial Technology |
| 3rd Author's Name | Tetsuo MACHIDA |
| 3rd Author's Affiliation | NIHON-MULTI Corporation |
| Date | 2009-12-18 |
| Paper # | EMD2009-107 |
| Volume (vol) | vol.109 |
| Number (no) | 352 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |