Presentation 2010-03-05
Throughput Performance Comparison between Overlap FDE and Sliding-window Chip Equalizer for DS-CDMA HARQ
Tatsunori OBARA, Kazuki TAKEDA, Fumiyuki ADACHI,
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Abstract(in English) In direct sequence code division multiple access (DS-CDMA), frequency-domain equalization (FDE) based on minimum mean square error (MMSE) criterion can achieve much better performance than the well-known rake combining. The conventional FDE requires the insertion of cyclic prefix (CP) into guard interval (GI). However, the CP insertion reduces the throughput. Recently, overlap FDE that requires no CP insertion was proposed. Another equalization technique is a time-domain sliding window chip equalizer (SWCE) based on MMSE criterion. In our previous paper, we evaluated and compared the bit error rate (BER) performances of multi-code DS-CDMA using SWCE and overlap FDE, and showed that overlap FDE can achieve almost the same BER performance as SWCE with much less computational complexity. In this paper, we evaluate by computer simulation and compare the throughput performances of DS-CDMA hybrid ARQ (HARQ) using overlap FDE and SWCE.
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Keyword(in English) Overlap FDE / Sliding-window chip equalizer (SWCE) / DS-CDMA / hybrid ARQ (HARQ)
Paper # RCS2009-308
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Committee RCS
Conference Date 2010/2/24(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Throughput Performance Comparison between Overlap FDE and Sliding-window Chip Equalizer for DS-CDMA HARQ
Sub Title (in English)
Keyword(1) Overlap FDE
Keyword(2) Sliding-window chip equalizer (SWCE)
Keyword(3) DS-CDMA
Keyword(4) hybrid ARQ (HARQ)
1st Author's Name Tatsunori OBARA
1st Author's Affiliation Dept. of Electrical and Communication Engineering, Graduate School of Engineering, Tohoku University()
2nd Author's Name Kazuki TAKEDA
2nd Author's Affiliation Dept. of Electrical and Communication Engineering, Graduate School of Engineering, Tohoku University
3rd Author's Name Fumiyuki ADACHI
3rd Author's Affiliation Dept. of Electrical and Communication Engineering, Graduate School of Engineering, Tohoku University
Date 2010-03-05
Paper # RCS2009-308
Volume (vol) vol.109
Number (no) 440
Page pp.pp.-
#Pages 6
Date of Issue