Presentation 2010-04-23
A Study of Highly Integrated Quasi-millimeter Front-end Circuits
Yo YAMAGUCHI, Takana KAHO, Kazuhiro UEHARA, Kiyomichi ARAKI,
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Abstract(in English) In these days, broadband network infrastructure is increasing in urban areas. However, in rural areas the digital divide issue, which is caused by an inadequate broadband network infrastructure. To overcome this problem, a fixed wireless system at quasi-millimeter-wave band has developed. To miniature the equipment and to avoid the use of quasi-millimeter-wave interconnects between chips or components, we have developed highly integrated MMICs using three dimensional MMIC technology. In this paper, we discussed implementation technique using flip-chip technology.
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Keyword(in English) Fixed wireless system / Flip-chip technology / Three dimensional MMIC / Highly Integration
Paper # SCE2010-12,MW2010-12
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Committee SCE
Conference Date 2010/4/16(1days)
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Registration To Superconductive Electronics (SCE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Study of Highly Integrated Quasi-millimeter Front-end Circuits
Sub Title (in English)
Keyword(1) Fixed wireless system
Keyword(2) Flip-chip technology
Keyword(3) Three dimensional MMIC
Keyword(4) Highly Integration
1st Author's Name Yo YAMAGUCHI
1st Author's Affiliation NTT Network Innovation Laboratories, NTT Corporation()
2nd Author's Name Takana KAHO
2nd Author's Affiliation NTT Network Innovation Laboratories, NTT Corporation
3rd Author's Name Kazuhiro UEHARA
3rd Author's Affiliation NTT Network Innovation Laboratories, NTT Corporation
4th Author's Name Kiyomichi ARAKI
4th Author's Affiliation Department of Electrical and Electronics Engineering, Tokyo Institute of Technology
Date 2010-04-23
Paper # SCE2010-12,MW2010-12
Volume (vol) vol.110
Number (no) 13
Page pp.pp.-
#Pages 5
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