Presentation | 2010-04-23 A Study of Highly Integrated Quasi-millimeter Front-end Circuits Yo YAMAGUCHI, Takana KAHO, Kazuhiro UEHARA, Kiyomichi ARAKI, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | In these days, broadband network infrastructure is increasing in urban areas. However, in rural areas the digital divide issue, which is caused by an inadequate broadband network infrastructure. To overcome this problem, a fixed wireless system at quasi-millimeter-wave band has developed. To miniature the equipment and to avoid the use of quasi-millimeter-wave interconnects between chips or components, we have developed highly integrated MMICs using three dimensional MMIC technology. In this paper, we discussed implementation technique using flip-chip technology. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Fixed wireless system / Flip-chip technology / Three dimensional MMIC / Highly Integration |
Paper # | SCE2010-12,MW2010-12 |
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Committee | SCE |
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Conference Date | 2010/4/16(1days) |
Place (in Japanese) | (See Japanese page) |
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Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Superconductive Electronics (SCE) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | A Study of Highly Integrated Quasi-millimeter Front-end Circuits |
Sub Title (in English) | |
Keyword(1) | Fixed wireless system |
Keyword(2) | Flip-chip technology |
Keyword(3) | Three dimensional MMIC |
Keyword(4) | Highly Integration |
1st Author's Name | Yo YAMAGUCHI |
1st Author's Affiliation | NTT Network Innovation Laboratories, NTT Corporation() |
2nd Author's Name | Takana KAHO |
2nd Author's Affiliation | NTT Network Innovation Laboratories, NTT Corporation |
3rd Author's Name | Kazuhiro UEHARA |
3rd Author's Affiliation | NTT Network Innovation Laboratories, NTT Corporation |
4th Author's Name | Kiyomichi ARAKI |
4th Author's Affiliation | Department of Electrical and Electronics Engineering, Tokyo Institute of Technology |
Date | 2010-04-23 |
Paper # | SCE2010-12,MW2010-12 |
Volume (vol) | vol.110 |
Number (no) | 13 |
Page | pp.pp.- |
#Pages | 5 |
Date of Issue |