Presentation	2010-06-30 Applications of Smart Cut^ Technologies to III-V Based Engineered Substrates Makoto YOSHIMI,
PDF Download Page	PDF download Page Link
Abstract(in Japanese)	(See Japanese page)
Abstract(in English)	Applications of Smart Cut^ technologies are reviewed focusing on III-V materials. Smart Cut can realize quite a high-performance structure by the best combination of materials for the device layer and the substrate. Wafer reclaim capability can also contribute to effective reduction of the wafer cost, together with selection of inexpensive material for the substrate.
Keyword(in Japanese)	(See Japanese page)
Keyword(in English)	Smart Cut / wafer bonding / SOI / GaN / power device / LED
Paper #	ED2010-54,SDM2010-55
Date of Issue

Conference Information
Committee	ED
Conference Date	2010/6/23(1days)
Place (in Japanese)	(See Japanese page)
Place (in English)
Topics (in Japanese)	(See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To	Electron Devices (ED)
Language	ENG
Title (in Japanese)	(See Japanese page)
Sub Title (in Japanese)	(See Japanese page)
Title (in English)	Applications of Smart Cut^ Technologies to III-V Based Engineered Substrates
Sub Title (in English)
Keyword(1)	Smart Cut
Keyword(2)	wafer bonding
Keyword(3)	SOI
Keyword(4)	GaN
Keyword(5)	power device
Keyword(6)	LED
1st Author's Name	Makoto YOSHIMI
1st Author's Affiliation	Soitec Asia, Inc.()
Date	2010-06-30
Paper #	ED2010-54,SDM2010-55
Volume (vol)	vol.110
Number (no)	109
Page	pp.pp.-
#Pages	2
Date of Issue