Presentation 2010-02-15
Test Pattern Re-Ordering for Thermal-Uniformity during Test
Makoto NAKAO, Tomokazu YONEDA, Michiko INOUE, Hideo FUJIWARA,
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Abstract(in English) Power consumption during VLSI testing varies spatially and temporally, and it leads to temperature variation during test. This paper presents a thermal-uniformity-aware test pattern re-ordering method to reduce temperature dependent delay variation for accurate delay testing. In the proposed method, we first divide a given test pattern sequence into a set of subsequences, and then re-order them so that the maximum temperature difference during test is minimized. Experimental results show that the proposed method can achieve thermal uniformity while preserving the power optimization effects such as power minimization or power variation minimization of the given ordered test set.
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Keyword(in English) thermal-uniformity / test pattern re-ordering
Paper # DC2009-66
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Committee DC
Conference Date 2010/2/8(1days)
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Registration To Dependable Computing (DC)
Language JPN
Title (in Japanese) (See Japanese page)
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Title (in English) Test Pattern Re-Ordering for Thermal-Uniformity during Test
Sub Title (in English)
Keyword(1) thermal-uniformity
Keyword(2) test pattern re-ordering
1st Author's Name Makoto NAKAO
1st Author's Affiliation Graduate School of Information Science, Nara Institute of Science and Technology()
2nd Author's Name Tomokazu YONEDA
2nd Author's Affiliation Graduate School of Information Science, Nara Institute of Science and Technology
3rd Author's Name Michiko INOUE
3rd Author's Affiliation Graduate School of Information Science, Nara Institute of Science and Technology
4th Author's Name Hideo FUJIWARA
4th Author's Affiliation Graduate School of Information Science, Nara Institute of Science and Technology
Date 2010-02-15
Paper # DC2009-66
Volume (vol) vol.109
Number (no) 416
Page pp.pp.-
#Pages 6
Date of Issue