Presentation 2009-11-19
GaN Re-growth Using Ta Mask Which Etches Covering GaN Layer
Kohei HARA, Yoshiki NAOI, Shiro SAKAI,
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Abstract(in English) Two step growth of GaN is performed, and the metal which is selectively sandwiched into GaN is formed. A GaN downward is etched away when Ta is selectively there. The mechanism is that TaN is formed at high temperature and separate into two, Ta and N2 gas. TaN is again formed, and the rest is in the same way. The usefulness of this technique is the use of the reflectance layer for the UV-LED which emits shorter than 370nm.
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Keyword(in English) GaN / Tantalum (Ta) / etching
Paper # ED2009-128,CPM2009-102,LQE2009-107
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Committee LQE
Conference Date 2009/11/12(1days)
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Registration To Lasers and Quantum Electronics (LQE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) GaN Re-growth Using Ta Mask Which Etches Covering GaN Layer
Sub Title (in English)
Keyword(1) GaN
Keyword(2) Tantalum (Ta)
Keyword(3) etching
1st Author's Name Kohei HARA
1st Author's Affiliation Faculty of Engineering, The University of Tokushima()
2nd Author's Name Yoshiki NAOI
2nd Author's Affiliation Faculty of Engineering, The University of Tokushima
3rd Author's Name Shiro SAKAI
3rd Author's Affiliation Faculty of Engineering, The University of Tokushima
Date 2009-11-19
Paper # ED2009-128,CPM2009-102,LQE2009-107
Volume (vol) vol.109
Number (no) 290
Page pp.pp.-
#Pages 4
Date of Issue