| Presentation | 2009-08-21 Adhesive Technology of Electronics Devices : Adhesion Characteristics Between Liquid Crystal Polymer and Epoxy Resin Adhesives Tomohiro FUKUHARA, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Relays are used for various purposes, and are demand for high reliability. Especially, Sealing relays are packaged with sealant to prevent from invasion of solder-flux, foreign matters, corrosive gas, etc. It is generally used one-packed epoxy resin adhesives as sealant to fulfill various demanded characteristics for relays. But, in recent years, lead-free soldering makes difficult seal relays because lead-free soldering has higher melting point than lead soldering. Another reason of difficulty of sealing is low adhesion characteristics between epoxy resin adhesives and Liquid Crystal Polymer which is used as base or case of relay. This report makes clear three points about adhesion characteristics between epoxy resin adhesives and Liquid Crystal Polymer. First of all, the mode of destruction of adhesion is cohesive destruction of Liquid Crystal Polymer. Secondary, interaction epoxy resin with Liquid Crystal Polymer depends on hardener of epoxy resin. Thirdly, imidazole-hardener causes large interaction with Liquid Crystal Polymer, and high sealing characteristics for relays. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Relay / Liquid Crystal Polymer / Epoxy / Imidazole / Adhesion |
| Paper # | EMD2009-56,CPM2009-80,OPE2009-104,LQE2009-63 |
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| Conference Information | |
| Committee | LQE |
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| Conference Date | 2009/8/13(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
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| Vice Chair | |
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| Paper Information | |
| Registration To | Lasers and Quantum Electronics (LQE) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Adhesive Technology of Electronics Devices : Adhesion Characteristics Between Liquid Crystal Polymer and Epoxy Resin Adhesives |
| Sub Title (in English) | |
| Keyword(1) | Relay |
| Keyword(2) | Liquid Crystal Polymer |
| Keyword(3) | Epoxy |
| Keyword(4) | Imidazole |
| Keyword(5) | Adhesion |
| 1st Author's Name | Tomohiro FUKUHARA |
| 1st Author's Affiliation | OMRON Corporation() |
| Date | 2009-08-21 |
| Paper # | EMD2009-56,CPM2009-80,OPE2009-104,LQE2009-63 |
| Volume (vol) | vol.109 |
| Number (no) | 176 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |