| 講演名 | 2009-06-25 Strain effects in van der Pauw (VDP) stress sensor fabricated on (111) silicon in electronic packages , |
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| 抄録(英) | We have fabricated VDP (van der Pauw) stress sensors on (111) silicon surfaces. Traditionally, VDP structures were used for the measurement of sheet resistance, R_s. However, as stress sensors, these are currently widely used to measure the die stresses in electronic packages because of their characteristics of higher sensitivities compared to the conventional resistor sensors. This work focuses on a study of strain effects in VDP stress sensors fabricated on (111) silicon, which were generally ignored in previous works, for the precise measurements of die stresses in electronic packages. Measurements were performed using resistor stress sensors as well as VDP stress sensors fabricated on (111) silicon, and corrected values of the Magnification factor coefficients are confirmed experimentally by comparing pairs of VDP stress sensor and resistive stress sensor. Also, the stress sensitivity was observed to be approximately 10% larger for p-type VDP sensors compared to n-type VDP sensors. Four-point bending (4PB) was used to generate the required stress in strip-on-beam samples. |
| キーワード(和) | |
| キーワード(英) | VDP (van der Pauw) / strain effects / (111) silicon / stress sensors / piezo-resistive coefficients |
| 資料番号 | ED2009-88,SDM2009-83 |
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| 研究会情報 | |
| 研究会 | SDM |
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| 開催期間 | 2009/6/17(から1日開催) |
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| 申込み研究会 | Silicon Device and Materials (SDM) |
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| 本文の言語 | ENG |
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| サブタイトル（和） | |
| タイトル（英） | Strain effects in van der Pauw (VDP) stress sensor fabricated on (111) silicon in electronic packages |
| サブタイトル（和） | |
| キーワード(1)（和/英） | / VDP (van der Pauw) |
| 第 1 著者 氏名（和/英） | / C.-H. Cho |
| 第 1 著者 所属（和/英） | Department of Electronic & Electrical Engineering, College of Science and Technology, Hongik University |
| 発表年月日 | 2009-06-25 |
| 資料番号 | ED2009-88,SDM2009-83 |
| 巻番号（vol） | vol.109 |
| 号番号（no） | 98 |
| ページ範囲 | pp.- |
| ページ数 | 4 |
| 発行日 | |