| Presentation | 2009-06-24 Simulation and Experiment of Liquid-Phase Microjoining Using Cone-Shaped Compliant Bump Li Jing Qiu, Naoya Watanabe, Tanemasa Asano, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In order to meet the requirements of high-density interconnection in 3D-LSI, we have proposed easy-deforming compliant bumps (10μm-diameter/20μm-pitch) to lower the pressing load during bonding. But still, when the number of I/O connections approaches to or larger than 1,000,000, the pressing load becomes too heavier to be carried out by an available flip-chip bonder. The load problems of compliant bumps can be overcome by liquid phase bonding method. On the other hand, the shrinkage of bump Pitch is restricted by the spread of melting solder as far as the existing bump technology is used. In this paper, this constraint can be overcome by using the cone-shaped compliant bump as a counter electrode of solder bump. We show experimental results together with simulation of fluid dynamics of molten solder. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | compliant bump / solder electrodes / liquid phase bonding / simulation / interconnection |
| Paper # | ED2009-66,SDM2009-61 |
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| Conference Information | |
| Committee | SDM |
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| Conference Date | 2009/6/17(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
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| Paper Information | |
| Registration To | Silicon Device and Materials (SDM) |
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| Language | ENG |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Simulation and Experiment of Liquid-Phase Microjoining Using Cone-Shaped Compliant Bump |
| Sub Title (in English) | |
| Keyword(1) | compliant bump |
| Keyword(2) | solder electrodes |
| Keyword(3) | liquid phase bonding |
| Keyword(4) | simulation |
| Keyword(5) | interconnection |
| 1st Author's Name | Li Jing Qiu |
| 1st Author's Affiliation | Department of Electronics, Graduate School of Information Science and Electrical Engineering, Kyushu University() |
| 2nd Author's Name | Naoya Watanabe |
| 2nd Author's Affiliation | Fukuoka Industry, Science & Technology Foundation (Fukuoka IST) |
| 3rd Author's Name | Tanemasa Asano |
| 3rd Author's Affiliation | Department of Electronics, Graduate School of Information Science and Electrical Engineering, Kyushu University |
| Date | 2009-06-24 |
| Paper # | ED2009-66,SDM2009-61 |
| Volume (vol) | vol.109 |
| Number (no) | 98 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |