| Presentation | 2009-02-20 Contact resistance analysis of electric contact with tin or silver plated layer Shigeru SAWADA, Kaori SHIMIZU, Yasuhiro HATTORI, Terutaka TAMAI, |
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| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Electrical contacts are an important part of electrical circuits and many reliability problems are related to electrical contacts' failure. It is important to investigate relationship between load and contact resistance which made contact reliability. In this study, the effect of contact shape, plating material and plating thickness on contact resistance was examined. The samples were constructed of a copper alloy with tin or silver plating. The resistance of the embossment shape and plane contact was measured by using a four-probe method at each contact load. And indentation contact area is measured by optical microscope. The experimental results of the relation between contact area and contact resistance were separated two parts as the load-contact area relation and the contact area-resistance relation. The load-contact area relation is predicted by FEM contact analysis and the contact area-resistance relation is analyzed by the theory of constriction resistance with plated layer. As results, the experimental results of silver plating sample which has no oxide film were good agreement with the theoretical results and the experimental results of tin plating sample which has oxide film were agreement with the theoretical results at higher load which is practical use of terminal connector. Therefore it is able to predict the load-contact resistance curve. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Electrical contact / contact resistance / plating / contact load / contact area |
| Paper # | R2008-44,EMD2008-120 |
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| Conference Information | |
| Committee | R |
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| Conference Date | 2009/2/13(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
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| Paper Information | |
| Registration To | Reliability(R) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Contact resistance analysis of electric contact with tin or silver plated layer |
| Sub Title (in English) | |
| Keyword(1) | Electrical contact |
| Keyword(2) | contact resistance |
| Keyword(3) | plating |
| Keyword(4) | contact load |
| Keyword(5) | contact area |
| 1st Author's Name | Shigeru SAWADA |
| 1st Author's Affiliation | Graduate School of Engineering, Mie University() |
| 2nd Author's Name | Kaori SHIMIZU |
| 2nd Author's Affiliation | AutoNetworks Technologies, Ltd. |
| 3rd Author's Name | Yasuhiro HATTORI |
| 3rd Author's Affiliation | AutoNetworks Technologies, Ltd. |
| 4th Author's Name | Terutaka TAMAI |
| 4th Author's Affiliation | Graduate School of Engineering, Mie University |
| Date | 2009-02-20 |
| Paper # | R2008-44,EMD2008-120 |
| Volume (vol) | vol.108 |
| Number (no) | 433 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |