Presentation 2009-01-29
Si-wire waveguide integrated device
Haruhiko YOSHIDA, Kazuya OHIRA, Taisuke SATO, Rei HASHIMOTO, Norio IIZUKA, Nobuo SUZUKI, Mizunori EZAKI,
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Abstract(in English) Silicon photonics on an SOI wafer or chip, which enables miniaturized optical interconnection down to submicron scale utilizing silicon-wire waveguide, has been attracting much attention as a promising platform for downsizing optical communication systems and reducing their energy consumption, in order to realize highly efficient functional optoelectronic devices applying nonlinear optical effects enhanced by strong optical confinement, and for overcoming the electronic wiring bottle-neck in increasing processing speed of LSI circuits. A compact spot-size converter, which is capable of efficient coupling between optical fiber and Si-wire, is a key device for both inter-chip and on-chip interconnections, and a cross-connect with small loss and low crosstalk between waveguides is also indispensable in order to realize highly flexible design of waveguide circuits on a chip. A compact and highly efficient photo-detector with high-speed responses integrated with silicon-wire waveguides is one of the most important devices for on-chip optical interconnects. In this paper, we propose a novel compact and efficient spot-size converter with very thin over-cladding and a flying-junction underpass Si-wire cross-connect, which is suited to integration with other optoelectronic devices and electronic circuits on an SOI wafer. These devices are designed by simulating three-dimensional light propagation, and also are demonstrated experimentally. Further, we propose an extremely small InGaAs-based MSM waveguide-photodetector, which is integrated with Si-wire on an SOI wafer, and its capability of highly-efficient operation is shown theoretically. Its fundamental operation at a wavelength of 1.55μm is also demonstrated by fabricating a device, which is integrated on Si-wire waveguide by applying direct wafer bonding.
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Keyword(in English) Optical interconnection / Si-wire / Spot-size converter / Cross waveguide / Photo-detector
Paper # PN2008-46,OPE2008-149,LQE2008-146
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Conference Information
Committee LQE
Conference Date 2009/1/22(1days)
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Paper Information
Registration To Lasers and Quantum Electronics (LQE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Si-wire waveguide integrated device
Sub Title (in English)
Keyword(1) Optical interconnection
Keyword(2) Si-wire
Keyword(3) Spot-size converter
Keyword(4) Cross waveguide
Keyword(5) Photo-detector
1st Author's Name Haruhiko YOSHIDA
1st Author's Affiliation Corporate R & D Center, Toshiba Corporation()
2nd Author's Name Kazuya OHIRA
2nd Author's Affiliation Corporate R & D Center, Toshiba Corporation
3rd Author's Name Taisuke SATO
3rd Author's Affiliation Corporate R & D Center, Toshiba Corporation
4th Author's Name Rei HASHIMOTO
4th Author's Affiliation Corporate R & D Center, Toshiba Corporation
5th Author's Name Norio IIZUKA
5th Author's Affiliation Corporate R & D Center, Toshiba Corporation
6th Author's Name Nobuo SUZUKI
6th Author's Affiliation Corporate R & D Center, Toshiba Corporation
7th Author's Name Mizunori EZAKI
7th Author's Affiliation Corporate R & D Center, Toshiba Corporation
Date 2009-01-29
Paper # PN2008-46,OPE2008-149,LQE2008-146
Volume (vol) vol.108
Number (no) 419
Page pp.pp.-
#Pages 6
Date of Issue