Presentation 2009-01-29
Reverse current reduction of Ge pin photodiodes on Si without post-growth annealing
Sungbong Park, Shinya Takita, Yasuhiko Ishikawa, Jiro Osaka, Kazumi Wada,
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Abstract(in English) A new approach to reduce the reverse current of Ge pin photodiodes on Si is presented, in which an i-Si layer is inserted between Ge and top Si layers to reduce the electric field in the Ge layer. Without post-growth annealing, the reverse current density is reduced to ~10mA/cm^2 at -1V, i.e. one order of magnitude lower than that of the reference photodiode without i-Si layer. The responsivity of the Ge photodiode reaches the nearly theoretical maximum. This "non-thermal" approach to reduce reverse current should accelerate electronics-photonics convergence using Ge on the Si CMOS platform.
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Paper # PN2008-44,OPE2008-147,LQE2008-144
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Committee LQE
Conference Date 2009/1/22(1days)
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Registration To Lasers and Quantum Electronics (LQE)
Language ENG
Title (in Japanese) (See Japanese page)
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Title (in English) Reverse current reduction of Ge pin photodiodes on Si without post-growth annealing
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1st Author's Name Sungbong Park
1st Author's Affiliation Department of Materials Engineering, Graduate School of Engineering The University of Tokyo()
2nd Author's Name Shinya Takita
2nd Author's Affiliation Department of Materials Engineering, Graduate School of Engineering The University of Tokyo
3rd Author's Name Yasuhiko Ishikawa
3rd Author's Affiliation Department of Materials Engineering, Graduate School of Engineering The University of Tokyo
4th Author's Name Jiro Osaka
4th Author's Affiliation Department of Materials Engineering, Graduate School of Engineering The University of Tokyo
5th Author's Name Kazumi Wada
5th Author's Affiliation Department of Materials Engineering, Graduate School of Engineering The University of Tokyo
Date 2009-01-29
Paper # PN2008-44,OPE2008-147,LQE2008-144
Volume (vol) vol.108
Number (no) 419
Page pp.pp.-
#Pages 5
Date of Issue