| Presentation | 2008-08-29 Thermal Stress Evaluation of Printed Circuit Board Connector Due to Current Flow by Using Thermography and Holography Hiromichi KUBOTA, Masanari TANIGUCHI, Hiroyuki ISHIDA, Shosuke SUZUKI, Tasuku TAKAGI, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Due to recent trends toward miniaturization and high density circuit configuration fields a high level current flow in Printed Circuit Board (PCB) and contacts. Thus the PCB connecotr is often affected by a thermal stress with the Joule's heat due to current flow. Thermal stress deforms the PCB connecotor, and the connected contacts of the PCB connector causes the contact failures may occur. In this study, by applying Thermal Graphic Measuring System (Thermography), the thermal pattern was analyzed of printed circuit board connector deformed due to current flow. And, the deformation pattern was measured by using the Holographic Interferometry Measuring System (Holography). As the results, both thermal pattern and deformation pattern were observed as a different pattern each other. And, we found that the Holography could be effectively used as a tool for analyzing PCB connector deformation with 3-D graphic image |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Holography / Themography / Printed circuit board connector / Thermal stress analysis |
| Paper # | EMD2008-59,CPM2008-74,OPE2008-89,LQE2008-58 |
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| Conference Information | |
| Committee | LQE |
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| Conference Date | 2008/8/21(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
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| Assistant | |
| Paper Information | |
| Registration To | Lasers and Quantum Electronics (LQE) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Thermal Stress Evaluation of Printed Circuit Board Connector Due to Current Flow by Using Thermography and Holography |
| Sub Title (in English) | |
| Keyword(1) | Holography |
| Keyword(2) | Themography |
| Keyword(3) | Printed circuit board connector |
| Keyword(4) | Thermal stress analysis |
| 1st Author's Name | Hiromichi KUBOTA |
| 1st Author's Affiliation | Tohoku Bunka Gakuen University() |
| 2nd Author's Name | Masanari TANIGUCHI |
| 2nd Author's Affiliation | Tohoku Bunka Gakuen University |
| 3rd Author's Name | Hiroyuki ISHIDA |
| 3rd Author's Affiliation | Tohoku Bunka Gakuen University |
| 4th Author's Name | Shosuke SUZUKI |
| 4th Author's Affiliation | Tohoku Bunka Gakuen University |
| 5th Author's Name | Tasuku TAKAGI |
| 5th Author's Affiliation | Tohoku Bunka Gakuen University |
| Date | 2008-08-29 |
| Paper # | EMD2008-59,CPM2008-74,OPE2008-89,LQE2008-58 |
| Volume (vol) | vol.108 |
| Number (no) | 194 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |