Presentation 2008-07-25
A Study on Temperature Distribution of a Wave Absorber Composed of Parallel Resistive Films under High Power Injection
Eriko WATANABE, Shinya WATANABE, Osamu HASHIMOTO, Toshifumi SAITO, Hiroshi KURIHARA,
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Abstract(in English) In this research, the temperature distribution of a wave Absorber composed of parallel resistive films under high-power is calculated using FDTD, Semi-Implicit Method for Pressure Linked Equations (SIMPLE), Monte Carlo and Radiative Energy Absorption Distribution (READ) methods. Next, a high power injection experiment is examined using the absorber and high power RF instruments to obtain the temperature distribution experimentally. Finally, the calculated and measured temperature distributions are compared and discussed.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) FDTD Method / Heat Transmission / Wave Absorber / High Power Injection
Paper # MW2008-78,OPE2008-61
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Committee OPE
Conference Date 2008/7/17(1days)
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Registration To Optoelectronics (OPE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Study on Temperature Distribution of a Wave Absorber Composed of Parallel Resistive Films under High Power Injection
Sub Title (in English)
Keyword(1) FDTD Method
Keyword(2) Heat Transmission
Keyword(3) Wave Absorber
Keyword(4) High Power Injection
1st Author's Name Eriko WATANABE
1st Author's Affiliation Department of Electrical Engineering and Electronics, College of Science and Engineering, Aoyama Gakuin University()
2nd Author's Name Shinya WATANABE
2nd Author's Affiliation Department of Electrical Engineering and Electronics, College of Science and Engineering, Aoyama Gakuin University
3rd Author's Name Osamu HASHIMOTO
3rd Author's Affiliation Department of Electrical Engineering and Electronics, College of Science and Engineering, Aoyama Gakuin University
4th Author's Name Toshifumi SAITO
4th Author's Affiliation TDK Corporation, Technical Center
5th Author's Name Hiroshi KURIHARA
5th Author's Affiliation TDK Corporation, Technical Center
Date 2008-07-25
Paper # MW2008-78,OPE2008-61
Volume (vol) vol.108
Number (no) 155
Page pp.pp.-
#Pages 5
Date of Issue