| Presentation | 2008-07-18 Problems and Prospect of 3D Integration using Wireless and Optical Interconnection Technologies Atsushi IWATA, Shin YOKOYAMA, |
|---|---|
| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In 3-D integration technology which aims to enhance integration scale and performance, chip-to-chip interconnection is the most important issue. At present, 3-D integration using trough Si via (TSV) are intensively developed targeting a large capacity memory. However, problems in testing and heat spread are not resolved. For 20 years, 3-D integration using optical interconnect has been studied. Recently, inductor coupling, capacitor coupling and antenna coupling have been studied to realize higher data rate with lower power dissipation comparing with the TSV method. If system is designed with sufficient noise margin, reliability of wireless interconnections does not degrade comparing with vias. In the future, these interconnections are combined and introduced to 3-D integration utilizing each features. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | trough silicon via (TSV) / optical interconnection / inductor coupling / capacitor coupling / radio wave coupling |
| Paper # | SDM2008-143,ICD2008-53 |
| Date of Issue |
| Conference Information | |
| Committee | ICD |
|---|---|
| Conference Date | 2008/7/10(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Problems and Prospect of 3D Integration using Wireless and Optical Interconnection Technologies |
| Sub Title (in English) | |
| Keyword(1) | trough silicon via (TSV) |
| Keyword(2) | optical interconnection |
| Keyword(3) | inductor coupling |
| Keyword(4) | capacitor coupling |
| Keyword(5) | radio wave coupling |
| 1st Author's Name | Atsushi IWATA |
| 1st Author's Affiliation | Graduate School of Advanced Sciences of Matter, Hiroshima University() |
| 2nd Author's Name | Shin YOKOYAMA |
| 2nd Author's Affiliation | Research Institute for Nanodevice and Bio Systems, Hiroshima University |
| Date | 2008-07-18 |
| Paper # | SDM2008-143,ICD2008-53 |
| Volume (vol) | vol.108 |
| Number (no) | 140 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |