Presentation 2008-06-13
Particle Performance Improvement of Single-Wafer Wet Cleaning for Next Generation
Ken-ichi SANO, Katsuhiko Miya, Akira Izumi, Jim Snow, Atsuro Eitoku,
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Abstract(in English) 3X-nm particles have been measured in recent years. This study focused on small particle removal and adhesion in a semiconductor wafer cleaning, countermeasures, as well as key major factors.
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Keyword(in English) Single-wafer cleaning / Particle / Two-fluid spray
Paper # ED2008-28
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Conference Information
Committee ED
Conference Date 2008/6/6(1days)
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Registration To Electron Devices (ED)
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Particle Performance Improvement of Single-Wafer Wet Cleaning for Next Generation
Sub Title (in English)
Keyword(1) Single-wafer cleaning
Keyword(2) Particle
Keyword(3) Two-fluid spray
1st Author's Name Ken-ichi SANO
1st Author's Affiliation Dainippon Screen MFG. Co., LTD.()
2nd Author's Name Katsuhiko Miya
2nd Author's Affiliation Dainippon Screen MFG. Co., LTD.
3rd Author's Name Akira Izumi
3rd Author's Affiliation Dainippon Screen MFG. Co., LTD.
4th Author's Name Jim Snow
4th Author's Affiliation Dainippon Screen MFG. Co., LTD.
5th Author's Name Atsuro Eitoku
5th Author's Affiliation Dainippon Screen MFG. Co., LTD.
Date 2008-06-13
Paper # ED2008-28
Volume (vol) vol.108
Number (no) 87
Page pp.pp.-
#Pages 5
Date of Issue