Presentation 2008/2/1
Wafer-Level-Packaging Inductor with Extremely High Quality Factor and its Application to 5.8GHz LC-type Voltage Controlled Oscillator
Hideki HATAKEYAMA, Kenichi OKADA, Kazuma OHASHI, Yusaku ITO, Yusuke UEMICHI, Naoyuki OZAWA, Masakazu SATO, Takuya AIZAWA, Tatsuya ITO, Ryozo YAMAUCHI, Kazuya MASU,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) In this paper, we propose a stacked-chip SiP technique, where a high quality-factor (Q) inductor chip fabricated using a Wafer Level Package (WLP) process is flipped and stacked on an LC-type Voltage Controlled Oscillator (LC-VCO) circuit chip. The phase noise of this device is -119dBc/Hz at a 1MHz offset for a 5.84GHz carrier frequency and the frequency tuning range is 5.73GHz-5.95GHz. Power consumption is 1.93mW and the Figure of Merit (FoM) is -192dBc/Hz. The designed and fabricated LC-VCO stacked with the WLP inductor has enough characteristics for the application of 5GHz wireless communication systems.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Wafer Level Package / Inductor / Voltage Controlled Oscillator
Paper # SDM2007-272
Date of Issue

Conference Information
Committee SDM
Conference Date 2008/2/1(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Wafer-Level-Packaging Inductor with Extremely High Quality Factor and its Application to 5.8GHz LC-type Voltage Controlled Oscillator
Sub Title (in English)
Keyword(1) Wafer Level Package
Keyword(2) Inductor
Keyword(3) Voltage Controlled Oscillator
1st Author's Name Hideki HATAKEYAMA
1st Author's Affiliation Integrated Research Institute, Tokyo Institute of Technology:Electron Device Laboratory, Fujikura Ltd()
2nd Author's Name Kenichi OKADA
2nd Author's Affiliation Integrated Research Institute, Tokyo Institute of Technology
3rd Author's Name Kazuma OHASHI
3rd Author's Affiliation Integrated Research Institute, Tokyo Institute of Technology
4th Author's Name Yusaku ITO
4th Author's Affiliation Integrated Research Institute, Tokyo Institute of Technology
5th Author's Name Yusuke UEMICHI
5th Author's Affiliation Electron Device Laboratory, Fujikura Ltd
6th Author's Name Naoyuki OZAWA
6th Author's Affiliation Electron Device Laboratory, Fujikura Ltd
7th Author's Name Masakazu SATO
7th Author's Affiliation Electron Device Laboratory, Fujikura Ltd
8th Author's Name Takuya AIZAWA
8th Author's Affiliation Electron Device Laboratory, Fujikura Ltd
9th Author's Name Tatsuya ITO
9th Author's Affiliation Electron Device Laboratory, Fujikura Ltd
10th Author's Name Ryozo YAMAUCHI
10th Author's Affiliation Fujikura Ltd
11th Author's Name Kazuya MASU
11th Author's Affiliation Integrated Research Institute, Tokyo Institute of Technology
Date 2008/2/1
Paper # SDM2007-272
Volume (vol) vol.107
Number (no) 481
Page pp.pp.-
#Pages 4
Date of Issue