Presentation | 2008/2/1 Wafer-Level-Packaging Inductor with Extremely High Quality Factor and its Application to 5.8GHz LC-type Voltage Controlled Oscillator Hideki HATAKEYAMA, Kenichi OKADA, Kazuma OHASHI, Yusaku ITO, Yusuke UEMICHI, Naoyuki OZAWA, Masakazu SATO, Takuya AIZAWA, Tatsuya ITO, Ryozo YAMAUCHI, Kazuya MASU, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | In this paper, we propose a stacked-chip SiP technique, where a high quality-factor (Q) inductor chip fabricated using a Wafer Level Package (WLP) process is flipped and stacked on an LC-type Voltage Controlled Oscillator (LC-VCO) circuit chip. The phase noise of this device is -119dBc/Hz at a 1MHz offset for a 5.84GHz carrier frequency and the frequency tuning range is 5.73GHz-5.95GHz. Power consumption is 1.93mW and the Figure of Merit (FoM) is -192dBc/Hz. The designed and fabricated LC-VCO stacked with the WLP inductor has enough characteristics for the application of 5GHz wireless communication systems. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Wafer Level Package / Inductor / Voltage Controlled Oscillator |
Paper # | SDM2007-272 |
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Conference Information | |
Committee | SDM |
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Conference Date | 2008/2/1(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | |
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Paper Information | |
Registration To | Silicon Device and Materials (SDM) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Wafer-Level-Packaging Inductor with Extremely High Quality Factor and its Application to 5.8GHz LC-type Voltage Controlled Oscillator |
Sub Title (in English) | |
Keyword(1) | Wafer Level Package |
Keyword(2) | Inductor |
Keyword(3) | Voltage Controlled Oscillator |
1st Author's Name | Hideki HATAKEYAMA |
1st Author's Affiliation | Integrated Research Institute, Tokyo Institute of Technology:Electron Device Laboratory, Fujikura Ltd() |
2nd Author's Name | Kenichi OKADA |
2nd Author's Affiliation | Integrated Research Institute, Tokyo Institute of Technology |
3rd Author's Name | Kazuma OHASHI |
3rd Author's Affiliation | Integrated Research Institute, Tokyo Institute of Technology |
4th Author's Name | Yusaku ITO |
4th Author's Affiliation | Integrated Research Institute, Tokyo Institute of Technology |
5th Author's Name | Yusuke UEMICHI |
5th Author's Affiliation | Electron Device Laboratory, Fujikura Ltd |
6th Author's Name | Naoyuki OZAWA |
6th Author's Affiliation | Electron Device Laboratory, Fujikura Ltd |
7th Author's Name | Masakazu SATO |
7th Author's Affiliation | Electron Device Laboratory, Fujikura Ltd |
8th Author's Name | Takuya AIZAWA |
8th Author's Affiliation | Electron Device Laboratory, Fujikura Ltd |
9th Author's Name | Tatsuya ITO |
9th Author's Affiliation | Electron Device Laboratory, Fujikura Ltd |
10th Author's Name | Ryozo YAMAUCHI |
10th Author's Affiliation | Fujikura Ltd |
11th Author's Name | Kazuya MASU |
11th Author's Affiliation | Integrated Research Institute, Tokyo Institute of Technology |
Date | 2008/2/1 |
Paper # | SDM2007-272 |
Volume (vol) | vol.107 |
Number (no) | 481 |
Page | pp.pp.- |
#Pages | 4 |
Date of Issue |