Presentation 2008-05-15
Investigation of deep levels in GaPN by photoconductivity transient measurement
Keita IZUMI, Hiroshi OKADA, Yuzo FURUKAWA, Akihiro WAKAHARA,
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Abstract(in English) In order to realize an optoelectronic integrated circuit (OEIC) united Si integrated circuit and luminescent device, a luminescent device has to be lattice matched to Si because III-V compound semiconductors are use a luminescent device. GaP_<0.98>N_<0.02> is lattice matched to Si. But, some defects in the luminescent materials degrades luminescent property. In this study, we investigated for deep levels by using photoconductivity transient measurement. According to temperature dependence of mobility, phonon scattering is dominant in n-type GaP. But, ionized impurity scattering is dominant in Si doped n-type GaP_<0.991>N_<0.009>. From photoconductivity transient measurement of GaPN with 1 % N content, there are no clear difference in defect formation by changing the dopant of Si and S.
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Keyword(in English) optoelectronic intergrated circuit / GaPN / photoconductivity transient measurement
Paper # ED2008-7,CPM2008-15,SDM2008-27
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Committee SDM
Conference Date 2008/5/8(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Investigation of deep levels in GaPN by photoconductivity transient measurement
Sub Title (in English)
Keyword(1) optoelectronic intergrated circuit
Keyword(2) GaPN
Keyword(3) photoconductivity transient measurement
1st Author's Name Keita IZUMI
1st Author's Affiliation Faculty of Engineering, Toyohashi University of Technology()
2nd Author's Name Hiroshi OKADA
2nd Author's Affiliation Faculty of Engineering, Toyohashi University of Technology
3rd Author's Name Yuzo FURUKAWA
3rd Author's Affiliation Faculty of Engineering, Toyohashi University of Technology
4th Author's Name Akihiro WAKAHARA
4th Author's Affiliation Faculty of Engineering, Toyohashi University of Technology
Date 2008-05-15
Paper # ED2008-7,CPM2008-15,SDM2008-27
Volume (vol) vol.108
Number (no) 36
Page pp.pp.-
#Pages 5
Date of Issue