Presentation | 2008-05-16 Al/Ti/Al Ohmic Contact to AlGaN/GaN Heterostructure Masanobu Hiroki, Kazumi Nishimura, Noriyuki Watanabe, Yasuhiro Oda, Takashi Kobayashi, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | In this letter, we report annealing temperature dependence of Al/Ti/Tl/Ni/Au contact structure on AlGaN/GaN heterostructures. In this structure, low contact resistivity below 5 x 10^<-6> Ωcm^2 was achieved by in wide range of thermal annealing from 650℃ to 900℃, while such low contact was only obtained in the range from 800℃ to 900℃ in conventional ohmic contact structure of Ti/Al/Ni/Au. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | GaN / AlGaN/GaN heterostructures / ohmic contact |
Paper # | ED2008-11,CPM2008-19,SDM2008-31 |
Date of Issue |
Conference Information | |
Committee | CPM |
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Conference Date | 2008/5/8(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
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Paper Information | |
Registration To | Component Parts and Materials (CPM) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Al/Ti/Al Ohmic Contact to AlGaN/GaN Heterostructure |
Sub Title (in English) | |
Keyword(1) | GaN |
Keyword(2) | AlGaN/GaN heterostructures |
Keyword(3) | ohmic contact |
1st Author's Name | Masanobu Hiroki |
1st Author's Affiliation | NTT Photonics Laboratories, NTT Corporation() |
2nd Author's Name | Kazumi Nishimura |
2nd Author's Affiliation | NTT Photonics Laboratories, NTT Corporation |
3rd Author's Name | Noriyuki Watanabe |
3rd Author's Affiliation | NTT Photonics Laboratories, NTT Corporation:(Present office)NTT Advanced Technology Corporation |
4th Author's Name | Yasuhiro Oda |
4th Author's Affiliation | NTT Photonics Laboratories, NTT Corporation |
5th Author's Name | Takashi Kobayashi |
5th Author's Affiliation | NTT Photonics Laboratories, NTT Corporation |
Date | 2008-05-16 |
Paper # | ED2008-11,CPM2008-19,SDM2008-31 |
Volume (vol) | vol.108 |
Number (no) | 35 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |