| Presentation | 2008-01-17 Implementation of 3-D Dynamically Reconfiguarable Device using Inter-Chip Wireless Communication Shotaro SAITO, Yasufumi SUGIMORI, Yoshinori KOHAMA, Tadahiro KURODA, Yohei HASEGAWA, Hideharu AMANO, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | This paper describes the physical design and evaluation of 3-D dynamically reconfigurable processor MuCCRA-Cube which consists of stacked MuCCRA chips. Each MuCCRA chip (plane) is architecturally identical, and it has a single array of reconfigurable Processing Elements (PEs) and data memory elements. Each plane can switch the PE-array structure based on the multicontext-style dynamic reconfiguration. For an inter-chip connection, a wireless communication technique based on the inductive coupling communication is provided. This is the profitable technique for developing cost-efficient and scalable multi-core architectures because several chips can be stacked after the chip fabrication with relatively low costs. We have developed a prototype chip of MuCCRA-Cube with ASPLA/STARC 90nm CMOS technology. Evaluation result shows that the feasibility of the 3-D stacked MuCCRA-Cube and the potential of the performance improvement. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Dynamically Reconfigurable Processor / 3D-IC / Inductive Coupling Communication |
| Paper # | VLD2007-123,CPSY2007-66,RECONF2007-69 |
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| Conference Information | |
| Committee | RECONF |
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| Conference Date | 2008/1/10(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
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| Paper Information | |
| Registration To | Reconfigurable Systems (RECONF) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Implementation of 3-D Dynamically Reconfiguarable Device using Inter-Chip Wireless Communication |
| Sub Title (in English) | |
| Keyword(1) | Dynamically Reconfigurable Processor |
| Keyword(2) | 3D-IC |
| Keyword(3) | Inductive Coupling Communication |
| 1st Author's Name | Shotaro SAITO |
| 1st Author's Affiliation | Department of Information and Computer Science, Keio University() |
| 2nd Author's Name | Yasufumi SUGIMORI |
| 2nd Author's Affiliation | Department of Information and Computer Science, Keio University |
| 3rd Author's Name | Yoshinori KOHAMA |
| 3rd Author's Affiliation | Department of Information and Computer Science, Keio University |
| 4th Author's Name | Tadahiro KURODA |
| 4th Author's Affiliation | Department of Information and Computer Science, Keio University |
| 5th Author's Name | Yohei HASEGAWA |
| 5th Author's Affiliation | Department of Information and Computer Science, Keio University |
| 6th Author's Name | Hideharu AMANO |
| 6th Author's Affiliation | Department of Information and Computer Science, Keio University |
| Date | 2008-01-17 |
| Paper # | VLD2007-123,CPSY2007-66,RECONF2007-69 |
| Volume (vol) | vol.107 |
| Number (no) | 419 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |