Presentation 2008-01-17
Wide-Band BPSK CMOS Demodulator Circuit
Yasuyuki ARAI, Jun KIKUCHI, Ryuichi UJIIE, Kenichi SHIBATA, Tetsuya HEIMA, Hisayasu SATO, Noboru ISHIHARA,
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Abstract(in English) In recent LSI systems, the wiring connections between the LSI and the LSI or the board and the board have become high density and complex. To overcome this problem, we have been studying about wireless RF interconnection circuit technologies. In this paper, a new wide-band BPSK demodulator circuit using sample and hold circuit technique has been proposed for the RF interconnections and fabricated by using 0.13μm CMOS process technology. The IC has demodulated 625Mb/s data on 5GHz RF signal properly consuming 46mW including output 50Ω driver with 1.2V power supply. The output data voltage swing was 550mVpp.
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Keyword(in English) Wide-Band / CMOS / BPSK / Demodulator / Sample and hold circuit / Amplifier
Paper # ED2007-215,MW2007-146
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Committee ED
Conference Date 2008/1/9(1days)
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Registration To Electron Devices (ED)
Language JPN
Title (in Japanese) (See Japanese page)
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Title (in English) Wide-Band BPSK CMOS Demodulator Circuit
Sub Title (in English)
Keyword(1) Wide-Band
Keyword(2) CMOS
Keyword(3) BPSK
Keyword(4) Demodulator
Keyword(5) Sample and hold circuit
Keyword(6) Amplifier
1st Author's Name Yasuyuki ARAI
1st Author's Affiliation Gunma University, Graduate School of Engineering()
2nd Author's Name Jun KIKUCHI
2nd Author's Affiliation Gunma University, Graduate School of Engineering
3rd Author's Name Ryuichi UJIIE
3rd Author's Affiliation Gunma University, Graduate School of Engineering
4th Author's Name Kenichi SHIBATA
4th Author's Affiliation Gunma University, Graduate School of Engineering
5th Author's Name Tetsuya HEIMA
5th Author's Affiliation Renesas Technology Corporation, Advanced Analog Technology Division
6th Author's Name Hisayasu SATO
6th Author's Affiliation Renesas Technology Corporation, Advanced Analog Technology Division
7th Author's Name Noboru ISHIHARA
7th Author's Affiliation Gunma University, Graduate School of Engineering
Date 2008-01-17
Paper # ED2007-215,MW2007-146
Volume (vol) vol.107
Number (no) 420
Page pp.pp.-
#Pages 6
Date of Issue