Presentation 2007-12-14
Shallow junction formed by semiconductor laser rapid heating
T. Sameshima, N. Sano, M. Naito,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We activated silicon implanted with dopant atoms by infrared semiconductor laser annealing with a 200-nm-thick diamond-like carbon optical absorption layer. When silicon samples implanted with phosphorus ions at 10 and 70keV with a concentration of 2×10^<15>cm^<-2> were annealed by irradiation with a 940nm continuous wave laser at 70kW/cm^2 for 2.6ms, the sheet resistance markedly decreased to 106 and 46Ω/sq, respectively. Moreover, when silicon samples implanted with BF_2 ions at 10keV with a concentration of 1.5×10^<15>cm^<-2> thorough 7.9-nm thermally grown SiO_2 layers were annealed by laser at 80kW/cm^2 for 2.6ms, the sheet resistance decreased to 531Ω/sq. Dopant diffusion caused by laser heating for the both cases was below 5nm. Activation of silicon implanted with impurity atoms was achieved with keeping the initial dopant in-depth profiles.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) activation / diffusion / sheet resistance / SIMS / free carrier
Paper # SDM2007-223
Date of Issue

Conference Information
Committee SDM
Conference Date 2007/12/7(1days)
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Paper Information
Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Shallow junction formed by semiconductor laser rapid heating
Sub Title (in English)
Keyword(1) activation
Keyword(2) diffusion
Keyword(3) sheet resistance
Keyword(4) SIMS
Keyword(5) free carrier
1st Author's Name T. Sameshima
1st Author's Affiliation Tokyo A & T Univ.()
2nd Author's Name N. Sano
2nd Author's Affiliation Hightec Systems Co.
3rd Author's Name M. Naito
3rd Author's Affiliation Nissin Ion Equipment Co., Ltd.
Date 2007-12-14
Paper # SDM2007-223
Volume (vol) vol.107
Number (no) 388
Page pp.pp.-
#Pages 4
Date of Issue