Presentation 2007-11-16
A NEW TDDB DEGRADATION MODEL BASED ON CU ION DRIFT IN CU INTERCONNECT DIELECTRICS
Naohito Suzumura, Shigehisa Yamamoto, Kazuya Makabe, Makoto Ogasawara, Junko Komori, Eiichi Murakami,
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Abstract(in English) A new physical model of Time-Dependent Dielectric Breakdown (TDDB) in Cu interconnect dielectrics is proposed. TDDB occurs due to the drift of Cu ions under an electric field E. An activation energy analysis of the leakage current demonstrates that these injected Cu ions affect the conduction mechanism of electrons. The dominant electron conduction mechanism changes from Poole-Frenkel electron current through the Cu barrier dielectrics to Fowler-Nordheim current due to the Cu pile-up at the cathode end. We assumed two possible types of Cu ion drift mechanism, Schottky type or Poole-Frenkel type. The field acceleration model (√E model) of the Poole-Frenkel type fits both TDDB lifetime and activation energy very well. The TDDB lifetime is proportional to the exponential of the square root of the electric field √E.
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Keyword(in English) Cu interconnect / Low-k dielectrics / Time-dependent dielectric breakdown(TDDB)
Paper # R2007-53,ED2007-186,SDM2007-221
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Committee ED
Conference Date 2007/11/9(1days)
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Registration To Electron Devices (ED)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A NEW TDDB DEGRADATION MODEL BASED ON CU ION DRIFT IN CU INTERCONNECT DIELECTRICS
Sub Title (in English)
Keyword(1) Cu interconnect
Keyword(2) Low-k dielectrics
Keyword(3) Time-dependent dielectric breakdown(TDDB)
1st Author's Name Naohito Suzumura
1st Author's Affiliation Renesas Technology Corp.()
2nd Author's Name Shigehisa Yamamoto
2nd Author's Affiliation Renesas Technology Corp.
3rd Author's Name Kazuya Makabe
3rd Author's Affiliation Renesas Technology Corp.
4th Author's Name Makoto Ogasawara
4th Author's Affiliation Renesas Technology Corp.
5th Author's Name Junko Komori
5th Author's Affiliation Renesas Technology Corp.
6th Author's Name Eiichi Murakami
6th Author's Affiliation Renesas Technology Corp.
Date 2007-11-16
Paper # R2007-53,ED2007-186,SDM2007-221
Volume (vol) vol.107
Number (no) 319
Page pp.pp.-
#Pages 6
Date of Issue