Presentation 2007-10-05
High Mobility Bottom Gate μc-Si TFT Fabricated by Microwave Plasma CVD
Akihiko HIROE, Akinobu TERAMOTO, Tadahiro OHMI,
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Abstract(in English) μc-Si has been deposited by microwave (2.45GHz) plasma CVD. (220) preferentially oriented film and (111) preferentially oriented film has been deposited and compared. (220) preferentially oriented film shows continuous cross sectional morphology, and has less dangling bond density compared with (111) preferentially oriented film. Bottom gate TFT has been fabricated with (220) preferentially oriented μc-Si. Mobility of about 1.4cm^2/Vsec and on/off ratio of more than 10^5 has been achieved for W/L=20/4μm bottom gate transistor after hydrogen plasma treatment.
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Keyword(in English) Microwave / Plasma CVD / μc-Si / TFT
Paper # SDM2007-186
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Conference Information
Committee SDM
Conference Date 2007/9/27(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) High Mobility Bottom Gate μc-Si TFT Fabricated by Microwave Plasma CVD
Sub Title (in English)
Keyword(1) Microwave
Keyword(2) Plasma CVD
Keyword(3) μc-Si
Keyword(4) TFT
1st Author's Name Akihiko HIROE
1st Author's Affiliation Ohmi Lab. New Industry Creation Hatchery Center (NICHe) Tohoku University()
2nd Author's Name Akinobu TERAMOTO
2nd Author's Affiliation Ohmi Lab. New Industry Creation Hatchery Center (NICHe) Tohoku University
3rd Author's Name Tadahiro OHMI
3rd Author's Affiliation Ohmi Lab. New Industry Creation Hatchery Center (NICHe) Tohoku University
Date 2007-10-05
Paper # SDM2007-186
Volume (vol) vol.107
Number (no) 245
Page pp.pp.-
#Pages 4
Date of Issue