Presentation 2007-09-27
Issues for the Jisso (Electronic Packaging) Technology to accommodate Electronic Equipments to Comfortable World
Hidetaka HAYASHI,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Nowadays we are facing to the environmental impact caused by electronic products that had been useful products as explosively aspiring ownership and explosive consumption of them. What is the key issue and evolution for Jisso technology as the basic technology to produce electronic hardware to keep global environment to be safe and comfortable? A lot of work has been done including legal system preparation to provide (1) proper countermeasure for toxic substances, (2) saving energy during both production process, usage and discarding, (3) recycling and saving resources. This article reviews the above work and claims that the view on the population trend and purchasing pressure of under developing countries should be more focused for the future work.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) EPR (Extended Producer's Responsibility) / RoHS Directive / WEEE Directive / EuP Directive / Eco-design / Recycle / Dematerialization / Recycling Society / Global Warming / World Population / RFID / UEEE / SEEE / REEE
Paper # CQ2007-53,OIS2007-43,IE2007-50
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Conference Information
Committee CQ
Conference Date 2007/9/20(1days)
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Paper Information
Registration To Communication Quality (CQ)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Issues for the Jisso (Electronic Packaging) Technology to accommodate Electronic Equipments to Comfortable World
Sub Title (in English)
Keyword(1) EPR (Extended Producer's Responsibility)
Keyword(2) RoHS Directive
Keyword(3) WEEE Directive
Keyword(4) EuP Directive
Keyword(5) Eco-design
Keyword(6) Recycle
Keyword(7) Dematerialization
Keyword(8) Recycling Society
Keyword(9) Global Warming
Keyword(10) World Population
Keyword(11) RFID
Keyword(12) UEEE
Keyword(13) SEEE
Keyword(14) REEE
1st Author's Name Hidetaka HAYASHI
1st Author's Affiliation School of Engineering, The University of Tokyo()
Date 2007-09-27
Paper # CQ2007-53,OIS2007-43,IE2007-50
Volume (vol) vol.107
Number (no) 229
Page pp.pp.-
#Pages 6
Date of Issue