Presentation | 2007-08-24 The Fabrication of Multi Wavelength CWDM Monolithic VCSELs for High Density Packaging Tei-ichi Suzuki, Daisuke Nagao, Yoshitsugu Wakazono, Atsushi Suzuki, Takaaki Ishikawa, Hiroshi Masuda, Yoichi Hashimoto, Katsuya Kikuchi, Mitsuaki Tamura, Hiroshi Nakagawa, Masahiro Aoyagi, Takashi Mikawa, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Two kinds of VCSELs with different wavelengths were monolithically fabricated on GaAs substrates for CWDM applications and high-density packaging. The oscillation wavelength was changed by varying the thickness of the dielectric layer placed in the cavity of the VCSELs. The both VCSELs fabricated in this work showed the single oscillation mode of LP_<01> and the oscillation wavelengths of 862nm and 848nm. The distance between centers of the VCSELs was 29μm and we could at a time guide the two beams from the VCSELs into multimode fibers or waveguides without optical elements like lenses. The optical modules equipped the VCSELs can offer high bit rates, small form factor and low cost. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | VCSEL / multiwavelength / CWDM / monolithic / optical module / high-density packaging |
Paper # | EMD2007-48,CPM2007-69,OPE2007-86,LQE2007-49 |
Date of Issue |
Conference Information | |
Committee | CPM |
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Conference Date | 2007/8/16(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | |
Vice Chair | |
Secretary | |
Assistant |
Paper Information | |
Registration To | Component Parts and Materials (CPM) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | The Fabrication of Multi Wavelength CWDM Monolithic VCSELs for High Density Packaging |
Sub Title (in English) | |
Keyword(1) | VCSEL |
Keyword(2) | multiwavelength |
Keyword(3) | CWDM |
Keyword(4) | monolithic |
Keyword(5) | optical module |
Keyword(6) | high-density packaging |
1st Author's Name | Tei-ichi Suzuki |
1st Author's Affiliation | National Institute of Advanced Industrial Science and Technology() |
2nd Author's Name | Daisuke Nagao |
2nd Author's Affiliation | National Institute of Advanced Industrial Science and Technology |
3rd Author's Name | Yoshitsugu Wakazono |
3rd Author's Affiliation | National Institute of Advanced Industrial Science and Technology |
4th Author's Name | Atsushi Suzuki |
4th Author's Affiliation | National Institute of Advanced Industrial Science and Technology |
5th Author's Name | Takaaki Ishikawa |
5th Author's Affiliation | National Institute of Advanced Industrial Science and Technology |
6th Author's Name | Hiroshi Masuda |
6th Author's Affiliation | National Institute of Advanced Industrial Science and Technology |
7th Author's Name | Yoichi Hashimoto |
7th Author's Affiliation | National Institute of Advanced Industrial Science and Technology |
8th Author's Name | Katsuya Kikuchi |
8th Author's Affiliation | National Institute of Advanced Industrial Science and Technology |
9th Author's Name | Mitsuaki Tamura |
9th Author's Affiliation | National Institute of Advanced Industrial Science and Technology |
10th Author's Name | Hiroshi Nakagawa |
10th Author's Affiliation | National Institute of Advanced Industrial Science and Technology |
11th Author's Name | Masahiro Aoyagi |
11th Author's Affiliation | National Institute of Advanced Industrial Science and Technology |
12th Author's Name | Takashi Mikawa |
12th Author's Affiliation | National Institute of Advanced Industrial Science and Technology |
Date | 2007-08-24 |
Paper # | EMD2007-48,CPM2007-69,OPE2007-86,LQE2007-49 |
Volume (vol) | vol.107 |
Number (no) | 197 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |