Presentation 2007-08-23
Chip-Scale Packaged PD-Array (CSP-PD)
Yoshiyuki DOI, Ikuo OGAWA, Takaharu OHYAMA, Akimasa KANEKO,
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Abstract(in English) We developed a chip-scale packaged photodiode array (CSP-PD) which is compact and hermetically sealed. In addition, we fabricated multi-channel monitors which integrated CSP-PDs on an electrical circuit board.
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Keyword(in English) PD-array / CSP-PD / Hermetic seal
Paper # EMD2007-36,CPM2007-57,OPE2007-74,LQE2007-37
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Conference Information
Committee CPM
Conference Date 2007/8/16(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Chip-Scale Packaged PD-Array (CSP-PD)
Sub Title (in English)
Keyword(1) PD-array
Keyword(2) CSP-PD
Keyword(3) Hermetic seal
1st Author's Name Yoshiyuki DOI
1st Author's Affiliation NTT Photonics Laboratories, NTT Corporation()
2nd Author's Name Ikuo OGAWA
2nd Author's Affiliation NTT Photonics Laboratories, NTT Corporation
3rd Author's Name Takaharu OHYAMA
3rd Author's Affiliation NTT Photonics Laboratories, NTT Corporation
4th Author's Name Akimasa KANEKO
4th Author's Affiliation NTT Photonics Laboratories, NTT Corporation
Date 2007-08-23
Paper # EMD2007-36,CPM2007-57,OPE2007-74,LQE2007-37
Volume (vol) vol.107
Number (no) 197
Page pp.pp.-
#Pages 6
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