Presentation | 2007-07-27 Development of Ultrasonic Welding Between Aluminum and Copper Hajime TAKADA, Yousuke TAKAYASHIKI, Yoshihiko WATANABE, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Recently, carmakers have adopted the use of aluminum for is used as a weight reduction material. And, technology that welds aluminum to copper is therefore necessary for producing W/H (Wire Harnesses). When the dissimilar metals such as aluminum and copper are welded by ultrasonic welding, a solid-state welding, it was found that metal crystals at the interface are joined and microscopic crystals are formed by the strong processing. In addition, weak intermetallic compounds are not found on the weld interface. Intermetallic compounds on the welding interface are generated and enlarged by thermal load. Welding interfaces that contained intermetallic compounds with a layer sickness of 10μm had a 30% reduction in tensile strength. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Copper / Aluminum / Ultrasonic welding / Intermetallic compound |
Paper # | EMCJ2007-40,EMD2007-26 |
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Conference Information | |
Committee | EMD |
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Conference Date | 2007/7/20(1days) |
Place (in Japanese) | (See Japanese page) |
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Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Electromechanical Devices (EMD) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Development of Ultrasonic Welding Between Aluminum and Copper |
Sub Title (in English) | |
Keyword(1) | Copper |
Keyword(2) | Aluminum |
Keyword(3) | Ultrasonic welding |
Keyword(4) | Intermetallic compound |
1st Author's Name | Hajime TAKADA |
1st Author's Affiliation | YAZAKI RESEARCH AND TECHNOLOGY CENTER, YAZAKI CORPORATION() |
2nd Author's Name | Yousuke TAKAYASHIKI |
2nd Author's Affiliation | YAZAKI RESEARCH AND TECHNOLOGY CENTER, YAZAKI CORPORATION |
3rd Author's Name | Yoshihiko WATANABE |
3rd Author's Affiliation | YAZAKI RESEARCH AND TECHNOLOGY CENTER, YAZAKI CORPORATION |
Date | 2007-07-27 |
Paper # | EMCJ2007-40,EMD2007-26 |
Volume (vol) | vol.107 |
Number (no) | 168 |
Page | pp.pp.- |
#Pages | 5 |
Date of Issue |