Presentation 2007-07-27
Mutual inductances between two superconducting striplines coupled through a grounded superconducting intermediate layer
Yoshinao MIZUGAKI, Ryuta KASHIWA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Mutual inductances between two superconducting strip lines coupled through a grounded intermediate layer are evaluated by both experiments and numerical calculation. A conventional superconducting quantum interference device method on Nb IC chips is used for experiments. Four test circuits are designed to investigate the effects of ground contacts. Grounding the intermediate layer at one point or at two points located perpendicular to the line direction does not improve the shielding effect, whereas grounding at two points located parallel to the line direction reduced the mutual inductance by 67%. Mutual inductances calculated using an inductance extraction program "FastHenry" agree with the experimental results. Numerical results of current distributions in the intermediate layers demonstrate that the enhanced shielding current improves the magnetic isolation.
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Keyword(in English) superconductor / Meissner effect / magnetic shield / niobium / FastHenry / SQUID
Paper # SCE2007-15
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Committee SCE
Conference Date 2007/7/20(1days)
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Registration To Superconductive Electronics (SCE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Mutual inductances between two superconducting striplines coupled through a grounded superconducting intermediate layer
Sub Title (in English)
Keyword(1) superconductor
Keyword(2) Meissner effect
Keyword(3) magnetic shield
Keyword(4) niobium
Keyword(5) FastHenry
Keyword(6) SQUID
1st Author's Name Yoshinao MIZUGAKI
1st Author's Affiliation Department of Electronic Engineering, The University of Electro-Communications()
2nd Author's Name Ryuta KASHIWA
2nd Author's Affiliation Department of Electronic Engineering, The University of Electro-Communications
Date 2007-07-27
Paper # SCE2007-15
Volume (vol) vol.107
Number (no) 171
Page pp.pp.-
#Pages 4
Date of Issue