Presentation 2007/6/18
Study of Ni/Cu Plating for High-Efficiency Crystalline Silicon Solar Cells
Bumho Kim, Junyoung Choi, Eunjoo Lee, Soohong Lee,
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Abstract(in English) The fabrication processes of high-efficiency crystalline silicon solar cells necessitate complicated fabrication processes and Ti/Pd/Ag contact, however, this contact formation processed by expensive materials. With alternative solution of like this demerit is low-cost nickel-copper metal contact has been formed by using a low-cost electroless and electroplating. Nickel-copper alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution. So, crystalline silicon solar cells of nickel-copper contact by plating are low-cost and high-efficiency. In this paper, we investigated low-cost nickel-copper contact formation of high-efficiency crystalline silicon solar cells by electroless and electroplating.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Solar cells / Electroplating / Electroless plating / Low cost / Contact / Nickel / Copper
Paper # ED2007-91,SDM2007-96
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Committee ED
Conference Date 2007/6/18(1days)
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Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Study of Ni/Cu Plating for High-Efficiency Crystalline Silicon Solar Cells
Sub Title (in English)
Keyword(1) Solar cells
Keyword(2) Electroplating
Keyword(3) Electroless plating
Keyword(4) Low cost
Keyword(5) Contact
Keyword(6) Nickel
Keyword(7) Copper
1st Author's Name Bumho Kim
1st Author's Affiliation Strategic Energy Research Institute, Dept. Electronic Engineering, Sejong University()
2nd Author's Name Junyoung Choi
2nd Author's Affiliation Strategic Energy Research Institute, Dept. Electronic Engineering, Sejong University
3rd Author's Name Eunjoo Lee
3rd Author's Affiliation Strategic Energy Research Institute, Dept. Electronic Engineering, Sejong University
4th Author's Name Soohong Lee
4th Author's Affiliation Strategic Energy Research Institute, Dept. Electronic Engineering, Sejong University
Date 2007/6/18
Paper # ED2007-91,SDM2007-96
Volume (vol) vol.107
Number (no) 110
Page pp.pp.-
#Pages 4
Date of Issue