| Presentation | 2007/6/18 Investigation of wafer warpage resulted from deep trench isolation in multi-layered SOI Jinwoo JEONG, Hyeon Cheol KIM, Kukjin CHUN, |
|---|---|
| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In this paper, the wafer warpage that originated from the stress of DTI(deep trench isolation) is investigated. The wafer warpage resulted from oxide filled DTI with 4μm width and 40μm depth is simulated and measured. The DTI using mixed layer of 1μm thermal oxide and 0.8μm poly silicon is also considered. The wafer warpages from the room temperature to 500℃ are measured and analyzed. It is verified that the main source of the wafer warpage is the thermal stress. The wafer warpages of these DTIs at the room temperature are simulated and compared with the measured values. The difference between two values is less than 5%. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Multi-layered SOI / Wafer Warpage / Deep Trench Isolation / Thermal Stress |
| Paper # | ED2007-85,SDM2007-90 |
| Date of Issue |
| Conference Information | |
| Committee | ED |
|---|---|
| Conference Date | 2007/6/18(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Electron Devices (ED) |
|---|---|
| Language | ENG |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Investigation of wafer warpage resulted from deep trench isolation in multi-layered SOI |
| Sub Title (in English) | |
| Keyword(1) | Multi-layered SOI |
| Keyword(2) | Wafer Warpage |
| Keyword(3) | Deep Trench Isolation |
| Keyword(4) | Thermal Stress |
| 1st Author's Name | Jinwoo JEONG |
| 1st Author's Affiliation | School of Electrical Engineering and Computer Science, Seoul National University() |
| 2nd Author's Name | Hyeon Cheol KIM |
| 2nd Author's Affiliation | School of Electrical Engineering and Computer Science, Seoul National University |
| 3rd Author's Name | Kukjin CHUN |
| 3rd Author's Affiliation | School of Electrical Engineering and Computer Science, Seoul National University |
| Date | 2007/6/18 |
| Paper # | ED2007-85,SDM2007-90 |
| Volume (vol) | vol.107 |
| Number (no) | 110 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |