Presentation 2007/6/18
Effect of a guard-ring on the leakage current in a Si-PIN X-ray detector for a single photon counting sensor
Jin-Young Kim, Jung-Ho Seo, Hyun-Woo Lim, Chang-Hyun Ban, Kyu-Chae Kim, Jin-Goo Park, Seong-Chae Jun, Bong-Hui Kim, Seung-Oh Jin, Young Hu,
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Abstract(in English) PIN diodes for digital X-ray detection as a single photon counting sensor were fabricated on a floating-zone (FZ) n-type (111), high resistivity (5~10kΩ・cm) silicon substrates (500μm thickness). Its electrical properties such as the leakage current and the breakdown voltage were characterized. The size of pixels was 100μm×100μm. The p+ guard-ring was formed around the active area to reduce the leakage current. After the p+ active area and guard-ring were fabricated by the ion-implantation, the extrinsic-gettering on the wafer backside was performed to reduce the leakage current by n+ ion-implantation. PECVD oxide was deposited as an IMD layer on front side and then, metal lines were formed on both sides of wafers. The leakage current of detectors was significantly reduced with a guard-ring when compared with that without a guard ring. The leakage current showed the strong dependency on the gap distance between the active area and the guard ring. It was possible to achieve the leakage current lower than 0.2 nA/cm^2.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) digital x-ray detection / leakage current / guard-ring / break-down voltage
Paper # ED2007-77,SDM2007-82
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Committee ED
Conference Date 2007/6/18(1days)
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Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Effect of a guard-ring on the leakage current in a Si-PIN X-ray detector for a single photon counting sensor
Sub Title (in English)
Keyword(1) digital x-ray detection
Keyword(2) leakage current
Keyword(3) guard-ring
Keyword(4) break-down voltage
1st Author's Name Jin-Young Kim
1st Author's Affiliation Department of Metallurgy and Materials Engineering, Micro Biochip Center, Hanyang University()
2nd Author's Name Jung-Ho Seo
2nd Author's Affiliation Department of Metallurgy and Materials Engineering, Micro Biochip Center, Hanyang University
3rd Author's Name Hyun-Woo Lim
3rd Author's Affiliation Department of Metallurgy and Materials Engineering, Micro Biochip Center, Hanyang University
4th Author's Name Chang-Hyun Ban
4th Author's Affiliation Department of Metallurgy and Materials Engineering, Micro Biochip Center, Hanyang University
5th Author's Name Kyu-Chae Kim
5th Author's Affiliation Department of Metallurgy and Materials Engineering, Micro Biochip Center, Hanyang University
6th Author's Name Jin-Goo Park
6th Author's Affiliation Department of Metallurgy and Materials Engineering, Micro Biochip Center, Hanyang University
7th Author's Name Seong-Chae Jun
7th Author's Affiliation Korea Electrotechnology Research Institute
8th Author's Name Bong-Hui Kim
8th Author's Affiliation Korea Electrotechnology Research Institute
9th Author's Name Seung-Oh Jin
9th Author's Affiliation Korea Electrotechnology Research Institute
10th Author's Name Young Hu
10th Author's Affiliation Korea Electrotechnology Research Institute
Date 2007/6/18
Paper # ED2007-77,SDM2007-82
Volume (vol) vol.107
Number (no) 110
Page pp.pp.-
#Pages 5
Date of Issue