| Presentation | 2007/6/18 Mechanical Stress Issues in Semiconductor Technology Jae Hoon CHOI, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | As semiconductor technology scales down, the stress induced change of device characteristics becomes more important in addition to the stress induced structure deformation or rupture. One should understand which conditions and shapes increase the stress, and choose a useful method to reduce or to utilize the stress. The performance could be raised by analyzing and considering the stress effects on the electrical characteristics with the design for manufacturing. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Stress / Strain / Thermal Expansion / Stress Proximity Effect |
| Paper # | ED2007-47,SDM2007-52 |
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| Conference Information | |
| Committee | ED |
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| Conference Date | 2007/6/18(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
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| Paper Information | |
| Registration To | Electron Devices (ED) |
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| Language | ENG |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Mechanical Stress Issues in Semiconductor Technology |
| Sub Title (in English) | |
| Keyword(1) | Stress |
| Keyword(2) | Strain |
| Keyword(3) | Thermal Expansion |
| Keyword(4) | Stress Proximity Effect |
| 1st Author's Name | Jae Hoon CHOI |
| 1st Author's Affiliation | R&D Division, Hynix Semiconductor() |
| Date | 2007/6/18 |
| Paper # | ED2007-47,SDM2007-52 |
| Volume (vol) | vol.107 |
| Number (no) | 110 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |