Presentation 2007-06-22
A study on decoupling characteristic of power distribution network of processor
Tomokazu IKENAGA, Satoshi KAZAMA, Masayuki SHIMIZU, Naoto YOKOYAMA,
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Abstract(in English) We compared characteristics of the transmission line decoupling device and combination of Ta cap and MLCC in the processor power distribution network. We measured frequency characteristics of total impedance including PCB for the evaluation of the total decoupling ability of the circuit board. We confirm that some combination of Ta Cap and MLCC shows better characteristics than transmission line device. We evaluated the amount of change of the voltage at the power distribution network by using the current load change device. From measured results, we found that the power supply ability decreased when we cut the power supply line for mounting device in order to reduce noise. We thought that the current concentrated in the device.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Decoupling / Load line Impedance / Resistance / High slew rate DC electronic load / Voltage
Paper # EMCJ2007-24
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Committee EMCJ
Conference Date 2007/6/15(1days)
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Paper Information
Registration To Electromagnetic Compatibility (EMCJ)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A study on decoupling characteristic of power distribution network of processor
Sub Title (in English)
Keyword(1) Decoupling
Keyword(2) Load line Impedance
Keyword(3) Resistance
Keyword(4) High slew rate DC electronic load
Keyword(5) Voltage
1st Author's Name Tomokazu IKENAGA
1st Author's Affiliation TAIYO YUDEN CO.,LTD.()
2nd Author's Name Satoshi KAZAMA
2nd Author's Affiliation TAIYO YUDEN CO.,LTD.
3rd Author's Name Masayuki SHIMIZU
3rd Author's Affiliation TAIYO YUDEN CO.,LTD.
4th Author's Name Naoto YOKOYAMA
4th Author's Affiliation TAIYO YUDEN CO.,LTD.
Date 2007-06-22
Paper # EMCJ2007-24
Volume (vol) vol.107
Number (no) 107
Page pp.pp.-
#Pages 6
Date of Issue