講演名 2007/6/18
3-Dimensional Vertically Integrated Nano-Shell All-Around-Gate MOSFET
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抄録(和)
抄録(英) This paper reports a novel 3-dimensional vertical nano-shell all-around-gate MOSFET for ultimate device scaling. The vertical nano-shell structure can be realized by introduction of a silicon thin-body formed by chemical vapor deposition (CVD) of poly-silicon and subsequent solid phase crystallization (SPC) as well as incorporation of an electrically independent inner-gate. It was verified that the vertical nano-shell MOSFET offers immunity to short-channel effects through a comparison of device performances between a nano-shell structure (double all-around-gate) and a nano-wire structure (single all-around-gate) with the aid of a SILVACO[○!R] 3-D simulator. With diverse modulations of the bias from the independently operated inner gate, the electrical characteristics of the MOSFET and the feasibility of application to a low-power transistor are investigated.
キーワード(和)
キーワード(英) Nano-shell structure / All-around-gate / Solid phase crystallization (SPC) / Short-channel effect (SCE)
資料番号 ED2007-61,SDM2007-66
発行日

研究会情報
研究会 SDM
開催期間 2007/6/18(から1日開催)
開催地(和)
開催地(英)
テーマ(和)
テーマ(英)
委員長氏名(和)
委員長氏名(英)
副委員長氏名(和)
副委員長氏名(英)
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幹事補佐氏名(英)

講演論文情報詳細
申込み研究会 Silicon Device and Materials (SDM)
本文の言語 ENG
タイトル(和)
サブタイトル(和)
タイトル(英) 3-Dimensional Vertically Integrated Nano-Shell All-Around-Gate MOSFET
サブタイトル(和)
キーワード(1)(和/英) / Nano-shell structure
第 1 著者 氏名(和/英) / Chung-Jin Kim
第 1 著者 所属(和/英)
School of Electrical Engineering & Computer Science, Korea Advanced Institute of Science and Technology
発表年月日 2007/6/18
資料番号 ED2007-61,SDM2007-66
巻番号(vol) vol.107
号番号(no) 111
ページ範囲 pp.-
ページ数 4
発行日