Presentation 2007-05-17
3-D Dynamically Reconfiguarable Device using Inter-Chip Wireless Communication MuCCRA-Cube
Shotaro SAITO, Yohei HASEGAWA, Yoshinori KOHAMA, Yasufumi SUGIMORI, Hideharu AMANO,
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Abstract(in English) In typical dynamically reconfiguarable devices, the overhead for programmable wires often forms critical paths by stretching delays, and requires a large power consumption. To address this problem, we propose a new dynamically reconfigurable architecture called MuCCRA-Cube. It is consisting of stacked MuCCRA chips, dynamically reconfiguarable devices, connected with wireless communication with inductive coupling. As a result, we found that the area overhead of 3D structuring is only about 10%, and it provides better area efficiency and power consumption.
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Keyword(in English) Dynamically Reconfigurable Processor / 3D-IC / Inductive Coupling Communication
Paper # RECONF2007-5
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Committee RECONF
Conference Date 2007/5/10(1days)
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Registration To Reconfigurable Systems (RECONF)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) 3-D Dynamically Reconfiguarable Device using Inter-Chip Wireless Communication MuCCRA-Cube
Sub Title (in English)
Keyword(1) Dynamically Reconfigurable Processor
Keyword(2) 3D-IC
Keyword(3) Inductive Coupling Communication
1st Author's Name Shotaro SAITO
1st Author's Affiliation Department of Information and Computer Science, Keio University()
2nd Author's Name Yohei HASEGAWA
2nd Author's Affiliation Department of Information and Computer Science, Keio University
3rd Author's Name Yoshinori KOHAMA
3rd Author's Affiliation Department of Information and Computer Science, Keio University
4th Author's Name Yasufumi SUGIMORI
4th Author's Affiliation Department of Information and Computer Science, Keio University
5th Author's Name Hideharu AMANO
5th Author's Affiliation Department of Information and Computer Science, Keio University
Date 2007-05-17
Paper # RECONF2007-5
Volume (vol) vol.107
Number (no) 41
Page pp.pp.-
#Pages 6
Date of Issue