| Presentation | 2007-03-06 A Study on Thermal Conduction and Distribution in SiC-SBD Package Tsuyoshi FUNAKI, Akira NISHIO, Takashi HIKIHARA, |
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| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Electrical characeristics of semiconductor devices vary with temperature. Thermal influence becomes more important for SiC devices, because it is expected to operate under wide temperature range. Heat generation by conduction loss and switching loss in power devices changes due to operating conditions. Therefore, it is inevitable to take the temperature dependency of characteristics of devices into account for the design of power conversion circuit. This paper models and analyzes heat conduction in SiC-SBD package with respect to current flow in electrical circuit. On the model we discuss the tenperature distribution with comparison to experimental results. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | SiC-SBD / heat conduction / thermal circuit / circuit simulator |
| Paper # | CAS2006-98,SIP2006-199,CS2006-115 |
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| Conference Information | |
| Committee | SIP |
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| Conference Date | 2007/2/27(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
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| Paper Information | |
| Registration To | Signal Processing (SIP) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | A Study on Thermal Conduction and Distribution in SiC-SBD Package |
| Sub Title (in English) | |
| Keyword(1) | SiC-SBD |
| Keyword(2) | heat conduction |
| Keyword(3) | thermal circuit |
| Keyword(4) | circuit simulator |
| 1st Author's Name | Tsuyoshi FUNAKI |
| 1st Author's Affiliation | Department of Electrical Engineering, Kyoto University() |
| 2nd Author's Name | Akira NISHIO |
| 2nd Author's Affiliation | Department of Electrical Engineering, Kyoto University |
| 3rd Author's Name | Takashi HIKIHARA |
| 3rd Author's Affiliation | Department of Electrical Engineering, Kyoto University |
| Date | 2007-03-06 |
| Paper # | CAS2006-98,SIP2006-199,CS2006-115 |
| Volume (vol) | vol.106 |
| Number (no) | 570 |
| Page | pp.pp.- |
| #Pages | 5 |
| Date of Issue | |