Presentation 2007-03-09
Effecto of the Number of Wiring Layers on the Chip Area of Multiplies
Hirotaka KAWASHIMA, Naofumi TAKAGI, Kazuyoshi TAKAGI,
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Abstract(in English) The number of metal layers usable for wiring is increasing because of the progress of manufacturing technologies of VLSI. The amount of interconnections which are wired above cells increases according to the increasesof wiring layers. Since the area for interconnections is reduced, circuits can be designed with smaller area. Multiplication is one of the basic arithmetic operations and many ASICs have multipliers. Multipliers occupy large area in ASICs and the size and the manufacturing cost of ASICs is effected by the area of multipliers. We have designed multipliers using various implementation, and have investigated the effect ofthe number of wiring layers on the chip area of multipliers.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) multiplier / multilayer interconnection / wiring layer / circuit area
Paper # VLD2006-141,ICD2006-232
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Conference Date 2007/3/2(1days)
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Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Effecto of the Number of Wiring Layers on the Chip Area of Multiplies
Sub Title (in English)
Keyword(1) multiplier
Keyword(2) multilayer interconnection
Keyword(3) wiring layer
Keyword(4) circuit area
1st Author's Name Hirotaka KAWASHIMA
1st Author's Affiliation Department of Infromation Engineering, Graduate School of Information Science, Nagoya University()
2nd Author's Name Naofumi TAKAGI
2nd Author's Affiliation Department of Infromation Engineering, Graduate School of Information Science, Nagoya University
3rd Author's Name Kazuyoshi TAKAGI
3rd Author's Affiliation Department of Infromation Engineering, Graduate School of Information Science, Nagoya University
Date 2007-03-09
Paper # VLD2006-141,ICD2006-232
Volume (vol) vol.106
Number (no) 552
Page pp.pp.-
#Pages 5
Date of Issue