Presentation 2007-01-19
High-Voltage High-Frequency (>10MHz) Class-E Amplifier Circuit Using a GaN-HEMT
Wataru SAITO, Tomokazu DOMON, Kunio TSUDA, Ichiro OMURA,
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Abstract(in English) GaN-HEMTs can realize high-voltage and ultra-low on-resistance due to high critical electric field and high electron mobility in 2DEG, and are attractive for the power switching device in motor driving systems and power supply systems. The device capacitance can be reduced, because the chip area can be shrunken by ultra-low specific on-resistance. Therefore GaN-HEMTs can operate at high-voltage and high-frequency condition, in which the conventional Si power device cannot be applied. The GaN-HEMT with the gate width of 3mm was fabricated and obtained the breakdown voltage of 380V, the on-resistance of 2mΩcm^2 and the maximum drain current of 1.9A. A 13.56MHz class-E amplifier circuit was demonstrated using the fabricated device and achieved the output power of 13.4W with the power efficiency of 91%. Moreover, a 27.1MHz circuit also achieved the output power of 13.8W with the power efficiency of 89.6%. These results show that high voltage GaN-devices are suitable for high frequency switching applications under high DC input voltages.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) GaN-HEMT / High Voltage / Power Device
Paper # ED2006-237,MW2006-190
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Committee ED
Conference Date 2007/1/10(1days)
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Registration To Electron Devices (ED)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) High-Voltage High-Frequency (>10MHz) Class-E Amplifier Circuit Using a GaN-HEMT
Sub Title (in English)
Keyword(1) GaN-HEMT
Keyword(2) High Voltage
Keyword(3) Power Device
1st Author's Name Wataru SAITO
1st Author's Affiliation Toshiba Corp. Semiconductor Company()
2nd Author's Name Tomokazu DOMON
2nd Author's Affiliation Toshiba Business and Life Service
3rd Author's Name Kunio TSUDA
3rd Author's Affiliation Toshiba Corp. R&D Center
4th Author's Name Ichiro OMURA
4th Author's Affiliation Toshiba Corp. Semiconductor Company
Date 2007-01-19
Paper # ED2006-237,MW2006-190
Volume (vol) vol.106
Number (no) 459
Page pp.pp.-
#Pages 4
Date of Issue