Presentation 2007-01-19
A Miniaturized, Wideband 8x8 Switch Matrix MMIC Using InP HEMTs
Hideki KAMITSUNA, Yasuro YAMANE, Masami TOKUMITSU, Hirohiko SUGAHARA, Takatomo ENOKI,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) An 8×8 switch matrix MMIC using cold-FET SP8T switches is presented. InP HEMTs with a low Ron・Coff product enable us to construct a dc-to-over-10-GHz SP8T switch in a series configuration. The multilayer interconnection with top-metal-and dielectric-layer thickness of 5μm allows us to configure interconnection transmission lines quite compactly, which is essential for wideband operation. The switch matrix IC using these technologies with a novel size-reduction technique is as small as 0.4mm^2 (core area) and achieves low insertion loss (<3.9dB) and high isolation (>26.5dB) below 10GHz. We confirmed error-free operation up to 12.5Gbit/s with good eye openings even when eight data signals are simultaneously input to the switch IC.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) FET switches / InP HEMT / MMIC switches / wideband / small / low power
Paper # ED2006-230,MW2006-183
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Committee ED
Conference Date 2007/1/10(1days)
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Registration To Electron Devices (ED)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Miniaturized, Wideband 8x8 Switch Matrix MMIC Using InP HEMTs
Sub Title (in English)
Keyword(1) FET switches
Keyword(2) InP HEMT
Keyword(3) MMIC switches
Keyword(4) wideband
Keyword(5) small
Keyword(6) low power
1st Author's Name Hideki KAMITSUNA
1st Author's Affiliation NTT Photonics Laboratories, NTT Corporation()
2nd Author's Name Yasuro YAMANE
2nd Author's Affiliation NTT Electronics NTT Advanced Technology
3rd Author's Name Masami TOKUMITSU
3rd Author's Affiliation NTT Photonics Laboratories, NTT Corporation
4th Author's Name Hirohiko SUGAHARA
4th Author's Affiliation NTT Advanced Technology
5th Author's Name Takatomo ENOKI
5th Author's Affiliation NTT Photonics Laboratories, NTT Corporation
Date 2007-01-19
Paper # ED2006-230,MW2006-183
Volume (vol) vol.106
Number (no) 459
Page pp.pp.-
#Pages 5
Date of Issue