| Presentation | 2007-01-19 Wideband Decoupling Properties by the Combination of Ultra-thin Insulator and EBG Structure Seiju ICHJO, Takanobu KUSHIHIRA, Toshio SUDO, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Wide-band decoupling property of power/ground structure of a printed circuit board is required for the high-speed digital applications. Low S21 property with around -60 dB can be obtained by simply using thin dielectric layer of 16 um. While, the EBG (electromagnetic bandgap) structure with relatively thick dielectric layer of 500 um showed the typical stop-band property. By combining ultra-thin dielectric layer and EBG structure, low S21 property with wideband upto several GHz range has been obtained along with high isolation property of more than -80dB. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Wideband decoupling property / thin insulator / EBG structure / EMI / SSN |
| Paper # | CPM2006-153,ICD2006-195 |
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| Conference Information | |
| Committee | CPM |
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| Conference Date | 2007/1/11(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Wideband Decoupling Properties by the Combination of Ultra-thin Insulator and EBG Structure |
| Sub Title (in English) | |
| Keyword(1) | Wideband decoupling property |
| Keyword(2) | thin insulator |
| Keyword(3) | EBG structure |
| Keyword(4) | EMI |
| Keyword(5) | SSN |
| 1st Author's Name | Seiju ICHJO |
| 1st Author's Affiliation | Toshiba Corporation() |
| 2nd Author's Name | Takanobu KUSHIHIRA |
| 2nd Author's Affiliation | Manufacturing Solution Company Ltd (work in Toshiba Corporation) |
| 3rd Author's Name | Toshio SUDO |
| 3rd Author's Affiliation | Toshiba Corporation |
| Date | 2007-01-19 |
| Paper # | CPM2006-153,ICD2006-195 |
| Volume (vol) | vol.106 |
| Number (no) | 467 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |