| Presentation | 2007-01-18 Fine Pitch Electronic Circuit Pattern Formation : The Synthetic Approach of Metal Nanoparticles Masami NAKAMOTO, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The melting points or sintering temperatures of metal nanoparticles with average diameters of several nanometer to several decade nanometers can be decreased below several hundred degrees. Based on such specific property, metal nanoparticles are expected to be used as the main component of the conductive paste for making fine pitch electronic circuit pattern less than 50μm on a plastic substrate such as polyimide film, glass-epoxy resin substrate, and PET film. Synthetic approach of the Ag, Au, and Cu nanoparticles and the Ag-Pd alloy nanoparticles and their application to the conductive paste are described in detail. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Metal Nanoparticles / Noble Metal Nanoparticle Paste / Silver-Palladium Alloy Nanoparticle Paste / Copper Nanoparticle Paste / Fine Pitch Electronic Circuit Patter Formation / Screen Printing |
| Paper # | CPM2006-135,ICD2006-177 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 2007/1/11(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Fine Pitch Electronic Circuit Pattern Formation : The Synthetic Approach of Metal Nanoparticles |
| Sub Title (in English) | |
| Keyword(1) | Metal Nanoparticles |
| Keyword(2) | Noble Metal Nanoparticle Paste |
| Keyword(3) | Silver-Palladium Alloy Nanoparticle Paste |
| Keyword(4) | Copper Nanoparticle Paste |
| Keyword(5) | Fine Pitch Electronic Circuit Patter Formation |
| Keyword(6) | Screen Printing |
| 1st Author's Name | Masami NAKAMOTO |
| 1st Author's Affiliation | Osaka Municipal Technical Research Institute() |
| Date | 2007-01-18 |
| Paper # | CPM2006-135,ICD2006-177 |
| Volume (vol) | vol.106 |
| Number (no) | 468 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |