Presentation 2007-01-18
Measurement of Delay Variation Due to Inductive Coupling Noise in 90nm Global Interconnects
Yasuhiro OGASAHARA, Masanori HASHIMOTO, Takao ONOYE,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) Inductive coupling is becoming a design concern for global interconnects in nano-meter technologies. This paper shows measurement results of inductive coupling effect on timing, and reveals that inductive coupling noise is a practical design issue in a 90nm technology. The measured delay change curve is consistent with circuit simulation results with RLC interconnect model, and definitely different from those of conventional RC model. Long-range effect and noise reduction by ground insertion are clearly observed on silicon.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) signal integrity / inductive crosstalk noise / interconnect delay / interconnect modeling
Paper # CPM2006-131,ICD2006-173
Date of Issue

Conference Information
Committee ICD
Conference Date 2007/1/11(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Measurement of Delay Variation Due to Inductive Coupling Noise in 90nm Global Interconnects
Sub Title (in English)
Keyword(1) signal integrity
Keyword(2) inductive crosstalk noise
Keyword(3) interconnect delay
Keyword(4) interconnect modeling
1st Author's Name Yasuhiro OGASAHARA
1st Author's Affiliation Dept. Information Systems Engineering, Osaka University()
2nd Author's Name Masanori HASHIMOTO
2nd Author's Affiliation Dept. Information Systems Engineering, Osaka University
3rd Author's Name Takao ONOYE
3rd Author's Affiliation Dept. Information Systems Engineering, Osaka University
Date 2007-01-18
Paper # CPM2006-131,ICD2006-173
Volume (vol) vol.106
Number (no) 468
Page pp.pp.-
#Pages 6
Date of Issue