| Presentation | 2006-12-15 EMI Model improvement taking LSI package structure into consideration Takahiro TSUDA, Takanori UNO, Kouji ICHIKAWA, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | An LSI EMI model was used to analyze conducted emission noise in a PCB. This model has been problem that the accuracy of it is low on high-frequency band. The attempt was made to improve the EMI model so as to achieve higher accuracy in the analysis, and its effectiveness was confirmed. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Large Scale Integration / Electro Magnetic Interference / Printed Circuit Board / Power Supply Integrity |
| Paper # | EMCJ2006-84 |
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| Conference Information | |
| Committee | EMCJ |
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| Conference Date | 2006/12/8(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
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| Paper Information | |
| Registration To | Electromagnetic Compatibility (EMCJ) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | EMI Model improvement taking LSI package structure into consideration |
| Sub Title (in English) | |
| Keyword(1) | Large Scale Integration |
| Keyword(2) | Electro Magnetic Interference |
| Keyword(3) | Printed Circuit Board |
| Keyword(4) | Power Supply Integrity |
| 1st Author's Name | Takahiro TSUDA |
| 1st Author's Affiliation | Vehicle Integrated System R&D Dept., DENSO CORPORATION() |
| 2nd Author's Name | Takanori UNO |
| 2nd Author's Affiliation | Vehicle Integrated System R&D Dept., DENSO CORPORATION |
| 3rd Author's Name | Kouji ICHIKAWA |
| 3rd Author's Affiliation | Vehicle Integrated System R&D Dept., DENSO CORPORATION |
| Date | 2006-12-15 |
| Paper # | EMCJ2006-84 |
| Volume (vol) | vol.106 |
| Number (no) | 433 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |