Presentation 2006-10-05
Improvement of Breakdown Voltage of AlGaN/GaN HEMT
Ken Nakata, Takeshi Kawasaki, Keita Matsuda, Takeshi Igarashi, Seiji Yaegassi,
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Abstract(in English) AlGaN/GaN HEMTs are attractive devices for high power switching applications because of their high electron mobility and high breakdown characteristics. But it is difficult to increase breakdown voltage because of large leakage current originated from the heteroepitaxial layer interface. To solve the issue, we have developed AlGaN/GaN HEMTs with Fe doped GaN buffer on Sapphire substrate. Fe doped GaN buffer suppress buffer leakage efficiently. We obtained the HEMT with the on-state resistance of 3.7 mΩcm^2 and the breakdown voltage of 940V. In the HEMT on Si substrate, leakage comes from vertical current flow through substrate. It is important to increase the epitaxial layer thickness for increase breakdown voltage.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) AlGaN / GaN / HEMT / power switching device / low specific on-state resistance / high breakdown voltage / Fe doping / Substrate
Paper # ED2006-153,CPM2006-90,LQE2006-57
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Conference Information
Committee LQE
Conference Date 2006/9/28(1days)
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Paper Information
Registration To Lasers and Quantum Electronics (LQE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Improvement of Breakdown Voltage of AlGaN/GaN HEMT
Sub Title (in English)
Keyword(1) AlGaN
Keyword(2) GaN
Keyword(3) HEMT
Keyword(4) power switching device
Keyword(5) low specific on-state resistance
Keyword(6) high breakdown voltage
Keyword(7) Fe doping
Keyword(8) Substrate
1st Author's Name Ken Nakata
1st Author's Affiliation Eudyna Devices Inc.()
2nd Author's Name Takeshi Kawasaki
2nd Author's Affiliation Eudyna Devices Inc.
3rd Author's Name Keita Matsuda
3rd Author's Affiliation Eudyna Devices Inc.
4th Author's Name Takeshi Igarashi
4th Author's Affiliation Eudyna Devices Inc.
5th Author's Name Seiji Yaegassi
5th Author's Affiliation Eudyna Devices Inc.
Date 2006-10-05
Paper # ED2006-153,CPM2006-90,LQE2006-57
Volume (vol) vol.106
Number (no) 271
Page pp.pp.-
#Pages 6
Date of Issue