Presentation 2006/10/12
Consideration on the emission characteristics from the edge of finite Microstrip board
Yusuke AIZAWA, Atsushi SUGENO, Takayasu SHIOKAWA,
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Abstract(in English) Recently, the emission from the circuit board becomes the one of the important EMC problem such as for the equipment system design. First in this paper, we discussed the characteristics of the emissions from the edge of the PCB with finite size. Next, we proposed the method that suppress these emissions and clarified the effect of this method by using FDTD simulation
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Keyword(in English) finite PCB / bending ground plane / suppression of emission / SWR / FDTD method
Paper # A・P2006-91
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Committee AP
Conference Date 2006/10/12(1days)
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Registration To Antennas and Propagation (A・P)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Consideration on the emission characteristics from the edge of finite Microstrip board
Sub Title (in English)
Keyword(1) finite PCB
Keyword(2) bending ground plane
Keyword(3) suppression of emission
Keyword(4) SWR
Keyword(5) FDTD method
1st Author's Name Yusuke AIZAWA
1st Author's Affiliation Graduate School of Engineering, Tohoku Gakuin University()
2nd Author's Name Atsushi SUGENO
2nd Author's Affiliation Faculty of Engineering, Tohoku Gakuin University
3rd Author's Name Takayasu SHIOKAWA
3rd Author's Affiliation Graduate School of Engineering, Tohoku Gakuin University
Date 2006/10/12
Paper # A・P2006-91
Volume (vol) vol.106
Number (no) 302
Page pp.pp.-
#Pages 6
Date of Issue