Presentation 2006/6/26
Evaluation of [111]-Textured Cu Layer Formed on Thin Nb Barrier Layer on SiO_2(Session 8A Silicon Devices V)
Md. Maniruzzaman, Mayumi B. Takeyama, Masaru Sato, Yuichiro Hayasaka, Eiji Aoyagi, Atsushi Noya,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We prepared a Cu layer of [111] preferential orientation on an extremely thin Nb barrier deposited on SiO_2. The Cu/Nb(10nm)/SiO_2/Si specimen was characterized by X-ray diffraction analyses of ω-rocking curve, pole figure, glancing incidence X-ray reflectivity (GIXR), and transmission electron microscopy (TEM). Pronounced (111) reflection in a pole figure and a full width at half maximum value of ~5° in an ω-rocking curve from the Cu layer indicated formation of Cu [111] texture on the 10nm thick Nb barrier thin enough to apply to the 90nm node technology. The GIXR measurements and TEM observation indicated the stable textured layers without excess interdiffusion and/or reaction at interfaces upon annealing at 500℃ for 1h.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Cu [111] texture / Thin Nb layer / Preferential orientation / X-ray reflectivity
Paper # ED2006-100,SDM2006-108
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Committee SDM
Conference Date 2006/6/26(1days)
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Registration To Silicon Device and Materials (SDM)
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Evaluation of [111]-Textured Cu Layer Formed on Thin Nb Barrier Layer on SiO_2(Session 8A Silicon Devices V)
Sub Title (in English)
Keyword(1) Cu [111] texture
Keyword(2) Thin Nb layer
Keyword(3) Preferential orientation
Keyword(4) X-ray reflectivity
1st Author's Name Md. Maniruzzaman
1st Author's Affiliation Department of Electrical and Electronic Engineering, Faculty of Engineering, Kitami Institute of Technology()
2nd Author's Name Mayumi B. Takeyama
2nd Author's Affiliation Department of Electrical and Electronic Engineering, Faculty of Engineering, Kitami Institute of Technology
3rd Author's Name Masaru Sato
3rd Author's Affiliation Department of Electrical and Electronic Engineering, Faculty of Engineering, Kitami Institute of Technology
4th Author's Name Yuichiro Hayasaka
4th Author's Affiliation Institute for Materials Research, Tohoku University
5th Author's Name Eiji Aoyagi
5th Author's Affiliation Institute for Materials Research, Tohoku University
6th Author's Name Atsushi Noya
6th Author's Affiliation Department of Electrical and Electronic Engineering, Faculty of Engineering, Kitami Institute of Technology
Date 2006/6/26
Paper # ED2006-100,SDM2006-108
Volume (vol) vol.106
Number (no) 138
Page pp.pp.-
#Pages 6
Date of Issue