Presentation 2006/6/26
High Current, High Power, and High Linearity Ohmic Recess InGaP/InGaAs Doped Channel FETs(Session 7B Compound Semiconductor Devices III)
Feng-Tso Chien, Chien-Liang Chan, Chien-Nan Liao, Jin-Mu Yin, Hsien-Chin Chiu, Feng Tsun Chien,
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Abstract(in English) Performance of contact resistance, dc, rf, microwave power, and device linearity characteristics between proposed partial drain/source ohmic recess InGaP/InGaAs/GaAs doped-channel FETs (OR-DCFETs) and the conventional doped-channel FETs (DCFETs) are compared in this research. The proposed ohmic recess process reduces the parasitic ohmic alloyed resistance caused by the undoped Schottky layer, and therefore improves the device performance in terms of dc, rf, source resistance as well as power characteristics. Owing to a lower source and drain resistances characteristic, OR-DCFETs demonstrated a high device current, high power-added efficiency (PAE), and better device linearity, which are very important for microwave power applications.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) InGaP/InGaAs / doped-channel EFTs / source and drain resistance / device linearity / PAE
Paper # ED2006-95,SDM2006-103
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Committee SDM
Conference Date 2006/6/26(1days)
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Registration To Silicon Device and Materials (SDM)
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) High Current, High Power, and High Linearity Ohmic Recess InGaP/InGaAs Doped Channel FETs(Session 7B Compound Semiconductor Devices III)
Sub Title (in English)
Keyword(1) InGaP/InGaAs
Keyword(2) doped-channel EFTs
Keyword(3) source and drain resistance
Keyword(4) device linearity
Keyword(5) PAE
1st Author's Name Feng-Tso Chien
1st Author's Affiliation Dept. of Electronic Engineering, Feng Chia University()
2nd Author's Name Chien-Liang Chan
2nd Author's Affiliation Dept. of Electronic Engineering, Feng Chia University
3rd Author's Name Chien-Nan Liao
3rd Author's Affiliation Dept. of Electronic Engineering, Feng Chia University
4th Author's Name Jin-Mu Yin
4th Author's Affiliation Dept. of Electronic Engineering, Feng Chia University
5th Author's Name Hsien-Chin Chiu
5th Author's Affiliation Dept. of Electronic Engineering, Chang Gung University
6th Author's Name Feng Tsun Chien
6th Author's Affiliation Dept. of Electronics Engineering, National Chiao Tung University
Date 2006/6/26
Paper # ED2006-95,SDM2006-103
Volume (vol) vol.106
Number (no) 138
Page pp.pp.-
#Pages 6
Date of Issue