Presentation 2006/6/26
Application of ELA in Si Transistors(Session 6A Silicon Devices III,AWAD2006)
Takashi NOGUCHI,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Effectiveness and its possibility of ELA (Excimer Laser Annealing) in advanced Si transistors are described. By reducing the process temperature and by improving the fabrication process as a LTPS (Low Temperature Poly-Si), FPD addressed by TFTs is expected to be mounted on flexible substrate. Extensive study is carried out to realize an advanced SoG (System on Glass). Mounting the functional devices on the insulating panels is expected using ELA. Although technical issues are remained for the fabrication process, Si TFTs formed by ELA enabling even 3D structure are expected as a functional Si system on insulator in the ubiquitous IT era.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) TFT / ELA / poly-Si / LTPS / FPD / SoP
Paper # ED2006-80,SDM2006-88
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Conference Information
Committee SDM
Conference Date 2006/6/26(1days)
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Paper Information
Registration To Silicon Device and Materials (SDM)
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Application of ELA in Si Transistors(Session 6A Silicon Devices III,AWAD2006)
Sub Title (in English)
Keyword(1) TFT
Keyword(2) ELA
Keyword(3) poly-Si
Keyword(4) LTPS
Keyword(5) FPD
Keyword(6) SoP
1st Author's Name Takashi NOGUCHI
1st Author's Affiliation Dept. of Electrical and Electronics Engineering, University of the Ryukyus()
Date 2006/6/26
Paper # ED2006-80,SDM2006-88
Volume (vol) vol.106
Number (no) 138
Page pp.pp.-
#Pages 4
Date of Issue